晶门半导体拟3月19日召开董事会会议审批全年业绩

和讯网03-04

格隆汇3月4日丨晶门半导体(02878.HK)宣布，将于2026年3月19日(星期四)召开董事会会议，以(其中包括)考虑及审批公司及其附属公司截至2025年12月31日止年度之综合全年业绩及其发布，以及考虑宣派末期股息(如有)及处理其他事务。本文来自和讯财经，更多精彩资讯请下载“和讯财经”APP

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