回天新材：公司已布局HBM、Chiplet等先进封装用胶产品

证券之星03-06

证券之星消息，回天新材(300041)03月06日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问全球市场的储存半导体供不应求，价格上涨，国产替代对于公司未来的业绩是否是正向影响？公司是否有能用于hbm，chiplet封装的相关产品？国内相关封装公司是否有公司的客户？

回天新材回复：您好！半导体行业国产替代进程加快，对公司电子胶业务发展具备积极影响。公司已布局HBM、Chiplet等先进封装用胶产品，相关产品已在客户处送样测试。公司将持续深耕高端电子胶领域，积极把握行业发展机遇。感谢您的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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