22TB/s 目标难实现：英伟达下调“Vera Rubin”VR200 所用 HBM4 规格，首批带宽约 20TB/s

IT之家03-04

感谢IT之家网友不一样的体验的线索投递！IT之家 3 月 4 日消息，据半导体行业研究机构 SemiAnalysis 最新报告，英伟达下一代“Rubin”GPU 架构的 HBM4 内存规格出现调整。由于 SK 海力士与三星电子在量产阶段难以达成原定的性能目标，英伟达已下调了对 HBM4 内存的带宽要求。根据规划，英伟达原本为 Rubin 芯片设定的总带宽目标为 22TB/s，但受限于供应商的...

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平台的带宽目标已经历经多次调整：2025 年 3 月，VR200 NVL72 系统的目标为 13TB/s；同年 9 月提升至 20.5TB/s；至 CES 2026 年期间又调至 22TB/s。实际上，英伟达一直将这一数字作为压制 AMD Instinct MI455X 加速器（19.6TB/s）的核心亮点。然而随着量产压力显现，实际表现将回落至 20TB/s 左右。在供应商格局方面，SemiAnalysis 预计 SK 海力士将占据英伟达 VR200 NVL72 系统 HBM4 供货量的约 70% 份额，三星电子则拿下剩余 30% 份额；美光已基本退出该平台的 HBM4 初期供应阵容。美光出局的主要原因在于其 HBM4 工程样品的引脚速率未能达到英伟达要求的 11Gbps 目标规格。据 TrendForce 集邦咨询此前报告，英伟达在 2025 年第三季度已将 HBM4 的数据传输速度要求上调至高于 11Gbps，这迫使三大供应商修正设计并重新送样。尽管美光声称已达成 11Gbps，但业内人士认为其在实际验证中仍面临挑战。不过，美光仍将在 Rubin 平台中扮演其他角色。据披露，美光将为“Vera”CPU 供应 LPDDR5X 内存，单颗 CPU 最高可支持 1.5TB 容量，以更大容量的内存方案弥补其在 HBM4 业务上的缺失。英伟达预计将在 3 月 16 日至 19 日举行的 GTC 2026 大会上正式展示搭载 HBM4 的 Vera Rubin 加速器。尽管带宽目标有所下调，Rubin 平台仍被视为英伟达巩固 AI 加速器霸主地位的关键一代产品。相关阅读：《消息称英伟达考虑对 Rubin GPU 的 HBM4 需求分档，兼顾性能与供应》《曝英伟达将使用 SK 海力士、三星 HBM4 生产 Vera Rubin AI 系统，美光缺席核心内存供应》","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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