接连押注，英伟达为何重仓布局光芯片？

第四波03-04

研究员｜林方舟3月4日，美国硅光子初创公司Ayar Labs宣布成功筹集5亿美元的E轮融资，由英伟达、联发科等巨头参投。在这两天前，英伟达还宣布向光子网络供应商 Lumentum和Coherent分别投资20亿美元，锁定未来先进激光组件的产能优选权和研发合作。硅光子技术从实验室走向市场，一个重要的推动因素是，AI大模型向千亿、万亿参数迭代的浪潮下，Token消耗量激增，算力需求迎来指数级爆发。不止...

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heavily in optical chips?","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDG":0.6,"NVII":0.6,"NVDQ":0.6,"NVDW":0.6,"NVD3.UK":0.6,"NVDB":0.6,"ANV":0.6,"2NVD.UK":0.6,"SNVD.UK":0.6,"NVIW.SI":0.6,"NVDY":0.6,"NVDX":0.6,"NVDS.UK":0.6,"NVD":0.6,"DIPS":0.6,"NVDU":0.6,"NVDD":0.6,"NVDS":0.6,"NVDA":1.97,"NVD2.UK":0.6,"3NVD.UK":0.6},"content_text":"研究员｜林方舟3月4日，美国硅光子初创公司Ayar Labs宣布成功筹集5亿美元的E轮融资，由英伟达、联发科等巨头参投。在这两天前，英伟达还宣布向光子网络供应商 Lumentum和Coherent分别投资20亿美元，锁定未来先进激光组件的产能优选权和研发合作。硅光子技术从实验室走向市场，一个重要的推动因素是，AI大模型向千亿、万亿参数迭代的浪潮下，Token消耗量激增，算力需求迎来指数级爆发。不止英伟达，谷歌、微软等巨头都在持续寻求AI算力瓶颈问题的解决方案。要解决这一难题，除了芯片本身，还有芯片之间的\"连接”。有研究表明，硅光子技术能在一定程度上，解决AI算力集群中芯片互联的带宽、功耗和距离三大难题。高速光模块、激光芯片等核心器件也因此变得“供不应求”。什么是硅光子？硅光子技术，是一种光通信技术。它使用激光束代替电子半导体信号传输数据，是基于硅和硅基衬底材料，利用现有CMOS工艺进行光器件开发和集成的新一代技术。通俗地解释，硅光技术就是用传统芯片制造工艺，集成一些光学元件，用“光”代替“电”作为信息载体，在硅芯片内部及芯片之间进行数据传输。其优势之一在于拥有较高的传输速率，可使处理器内核之间的数据传输速率翻倍提升。在AI大模型训练过程中，需要将成千上万张GPU连接在一起，组成一个超级计算集群。它们像一支交响乐团一样协同工作，每时每刻都在互相交换海量数据。但传统的电信号传输，逐渐受限于能耗与距离瓶颈，难以支撑AI大模型训练所需的庞大数据流量。当传输速率突破400Gbps并向800Gbps乃至1.6Tbps演进，铜导线因其物理特性，导致信号衰减严重，发热迅速增加、能耗急剧上升——这好比高峰道路，车道太窄、车太多，堵车了。硅光子技术或许就能极大缓解数据传输中的“堵车”现象。来自陕西一科研机构的文章介绍，作为光模块的核心组件，硅基光电子芯片既拥有光的极高带宽、超高速率和高抗干扰特性，也拥有微电子技术在大规模集成、低能耗、低成本等方面的优势。在硅光子这个赛道，目前较为热门的是两条技术路线：CPO和OIO。两者都是将光芯片和电芯片封装在一起。CPO中文叫“共封装光学”，通过将光引擎与交换芯片共同封装在同一基底或插槽中，实现芯片级集成。OIO中文叫“光互连输入输出”，通过先进封装以芯粒形式与计算芯片集成，比CPO的互连性能更优，进一步提升带宽密度、降低延迟，能效提升相比CPO低一个数量级。在被联发科、英伟达等公司参投后，Ayar Labs就表示，希望通过获得融资，加速其CPO技术的量产。为何英伟达接连大手笔布局？除了Ayar Labs，英伟达还投资了Lumentum和Coherent公司，两者位于产业链更上游，专注于研发和制造底层的高性能激光器和光学元件。根据多家券商、研究机构分析，2026年，很可能将成为硅光技术大规模商用的关键转折点，即硅光芯片商转元年。在终端产品方面，光模块厂商也已开始收获果实。中国最大的激光装备制造商之一“华工科技”宣布，1.6T光模块的规模化商用预计将在2026年全面启动，并已发布全球首款3.2T NPO（线性驱动可插拔光模块）产品。全球主要硅光代工厂正以前所未有的力度扩产。英伟达合作伙伴高塔半导体（Tower）宣称，计划到2026年第四季度，将其硅光晶圆月产能提升至2025年同期的5倍以上。其截至2028年的产能中，超过70%已被客户预订。全球最大的纯硅光子芯片代工厂格芯（GlobalFoundries）也称，预计其2026年硅光业务收入将接近3亿美元。即便如此，拉升之后的产能依然与蓬勃的市场需求之间存在缺口。野村证券研报显示，2026年全球先进光芯片产能同比增长超80%，但仍落后市场需求5%-15%。放眼国内，中国在硅光领域也已经有不少成熟的公司，例如全球光模块龙头“中际旭创”，推出搭载自研硅光芯片的400G和800G硅光模块，是英伟达AI集群的核心供应商之一。此外，中国企业在核心材料与器件、光模块与设备、乃至硅光技术在更长远领域的应用探索，都有所布局。近期，国内专注硅光芯片设计与研发的初创公司也相继获得资本市场的关注。成立于2025年9月灵熹光子今年2月完成数千万元天使轮融资，公司主要提供面向AI算力集群的CPO/OIO光互连解决方案。主营业务包括硅光子传输芯片（PIC）、光模块及CPO技术的珠海量引科技有限公司也在2月完成数千万元天使轮融资。野村证券研报显示，800G与1.6T光模块出货量将在2026年实现显著翻倍，而硅光子技术在这一市场的渗透率预计将达到50%-70%，成为行业增长的核心引擎。编辑｜邱慧","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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