台积电先进封装布局（2026最新版）

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台积电先进封装布局2026台积电2026年先进封装布局兼顾海内外拓展与技术迭代，核心围绕CoWoS、SoIC、InFO等关键技术展开。海外方面，其先进封装实现首发，将通过与Amkor合作，利用亚利桑那厂于2026年提供在地封装服务，同时已申请许可在美国亚利桑那凤凰城、日本熊本兴建首座先进封测厂，暂无具体整体计划。台湾本土厂区各有侧重：龙潭厂持续供应苹果iPhone处理器封装，首条CoPoS实验线...

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