首发“1.6nm”工艺 NVIDIA下代GPU费曼要跟Intel联手：10亿美元合作

快科技03-04

快科技3月4日消息，本月中旬NVIDIA就要开GTC 2026大会了，届时除了会公布前所未见的芯片——LPU之外，下一代GPU架构Feynman费曼应该也会发布。Feynman的具体架构目前肯定是没消息了，去年GTC公布的唯一消息就是搭配下一代HBM内存，估计是首发HBM4e，带宽更高。这一代GPU的升级会有一波大升级，那就是首发台积电的1.6nm级工艺A16，除了GAA晶体管架构之外，还首次支持...

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process NVIDIA's next generation GPU Feynman wants to join hands with Intel: $1 billion cooperation","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDS":0.6,"INTC":1.92,"NVDQ":0.6,"3NVD.UK":0.6,"NVDU":0.6,"SNVD.UK":0.6,"NVD2.UK":0.6,"NVIW.SI":0.6,"NVDY":0.6,"NVDG":0.6,"NVD":0.6,"INTW":0.6,"DIPS":0.6,"NVII":0.6,"NVDB":0.6,"NVDD":0.6,"NVDW":0.6,"ANV":0.6,"NVD3.UK":0.6,"NVDA":1.95,"NVDX":0.6,"2NVD.UK":0.6,"LINT":0.6,"04335":1.92,"NVDS.UK":0.6},"content_text":"快科技3月4日消息，本月中旬NVIDIA就要开GTC 2026大会了，届时除了会公布前所未见的芯片——LPU之外，下一代GPU架构Feynman费曼应该也会发布。Feynman的具体架构目前肯定是没消息了，去年GTC公布的唯一消息就是搭配下一代HBM内存，估计是首发HBM4e，带宽更高。这一代GPU的升级会有一波大升级，那就是首发台积电的1.6nm级工艺A16，除了GAA晶体管架构之外，还首次支持了SRP背面供电，提升了密度和性能，还提高了供电能力。背面供电比较适合HPC高性能芯片，但不太适合移动芯片，不利于低功耗场景，因此A16工艺可能是NVIDIA独占，后续也许有AMD等其他HPC企业跟进。虽然Feynman的GPU生产还会依赖台积电，但这次的封装技术上有望多一个方案，那就是Intel的EMIB-T技术，富国银行最新报告中认为两家会在这方面合作，有望给Intel代工业务创造10亿美元的营收。EMIB-T是Intel在EMIB封装基础上升级TSV硅穿孔的高级芯片封装技术，带来了性能提升、功耗及延迟降低等优势，有望跟台积电的CoWoS封装技术竞争，因此不少厂商都有兴趣。除了NVIDIA之外，苹果、高通也有可能是EMIB-T封装技术的客户，Intel就算抢不到这些厂商的2nm、1.6/1.4nm芯片订单，拿下一些封装订单也非常好了，一步步获得客户认可才是关键的。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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