新增多起GaN合作：罗姆&台积电、EPC&瑞萨等

行家说三代半02-26

近期，“行家说三代半”发现，罗姆、台积电、EPC、瑞萨电子、汉骅半导体、等多家企业，在氮化镓功率半导体领域相继披露了重要合作与战略进展。罗姆&台积电：双方深化合作，助力罗姆构建端到端的氮化镓生产体系；EPC&瑞萨电子：达成全面的氮化镓技术授权协议;汉骅半导体：发布12英寸GaN外延，并与下游功率器件头部企业达成合作。罗姆&台积电：深化技术合作，构建端到端GaN生产体系2月26日，罗姆宣布与台积电...

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etc.","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"TSMG":0.6,"03145":0.6,"TSMY":0.6,"TSMZ":0.6,"TSMU":0.6,"STSM":0.6,"TSMX":0.6,"TSM":1.93},"content_text":"近期，“行家说三代半”发现，罗姆、台积电、EPC、瑞萨电子、汉骅半导体、等多家企业，在氮化镓功率半导体领域相继披露了重要合作与战略进展。罗姆&台积电：双方深化合作，助力罗姆构建端到端的氮化镓生产体系；EPC&瑞萨电子：达成全面的氮化镓技术授权协议;汉骅半导体：发布12英寸GaN外延，并与下游功率器件头部企业达成合作。罗姆&台积电：深化技术合作，构建端到端GaN生产体系2月26日，罗姆宣布与台积电达成进一步深度合作，双方将实现技术优势互补，把罗姆在氮化镓功率器件领域的研发、制造技术与台积电的先进工艺技术相结合，在罗姆集团内部搭建端到端的完整生产体系。根据双方新近签署的许可协议，台积电将向罗姆滨松转让工艺技术，罗姆滨松计划于2027年正式建立生产体系，重点满足人工智能服务器和电动汽车等领域对氮化镓器件日益增长的市场需求。此次技术整合与转让，标志着罗姆与台积电的合作关系进入全新深化阶段。值得注意的是，技术转让完成后，罗姆和台积电将友好终止双方在汽车氮化镓领域的合作关系，但这并不影响双方的长期协同，双方将继续加强合作，聚焦更高效率、更紧凑的电源系统研发，持续推动氮化镓技术的迭代升级。此外，除台积电外，罗姆还与英伟达、村田、科索等行业龙头达成深度合作，将氮化镓、EcoSiC™ 等产品落地于45W AC适配器、AI 服务器等核心场景，通过多方协同加速高压技术规模化应用。EPC&瑞萨电子:达成氮化镓技术授权协议2月19日，EPC宣布与瑞萨电子达成一项全面的技术授权协议。根据协议，瑞萨电子将取得EPC成熟的低压eGaN技术，及其完善的供应链生态，从而加速高性能氮化镓解决方案在市场中的应用。此外，双方将在未来一年内合作建立这些产品的晶圆制造能力。瑞萨电子还将作为第二货源供应商，生产EPC已量产的多款热门氮化镓器件，增强客户供应链的稳定性与韧性。通过此次合作，借助EPC在低压eGaN领域的专业技术积累，瑞萨电子将进一步丰富自身产品布局，有望打造业界最全面的氮化镓功率产品组合之一，实现从低压到高压应用场景的全面覆盖，持续推动氮化镓技术革命。瑞萨电子氮化镓事业部副总裁Rohan Samsi 表示：与 EPC 达成的这项协议，与其既有的 650V 以上高压产品组合形成互补，使他们能够抓住高需求市场的机遇。事实上，近年来瑞萨电子一直在持续布局氮化镓领域：2024年6月：完成了对D-mode氮化镓代表性企业Transphorm的收购；2025年4月：与美国Polar Semiconductor达成战略协议，宣布将在Polar的美国8英寸车规级量产工厂生产硅基氮化镓器件；2025年中旬：陆续推出3款650V氮化镓器件，并计划在年底推出低压E-mode氮化镓产品系列，耐压等级覆盖65V至150V，重点瞄准服务器电源等DC-DC同步整流拓扑电路；2025年10月：与奥海科技联合成立的“联合创新实验室”正式揭牌，聚焦高功率服务器电源等。汉骅半导体：发布12吋GaN外延2月25日，苏州汉骅半导体正式发布12英寸硅基氮化镓功率外延产品，并与下游知名功率器件厂商达成深度战略合作。据介绍，苏州汉骅半导体与下游功率器件头部企业将聚焦高效电源、伺服驱动、车载等场景展开联合开发与性能优化，同时共同推进面向工业自动化、机器人等高端装备领域的系统级解决方案。双方旨在构建覆盖“外延—器件—模组—系统”的完整产业链生态，推动GaN功率器件在关键领域的规模化应用，助力我国功率半导体产业链的自主可控与高质量发展。值得关注的是，早在2022年9月，苏州汉骅半导体就完成了数亿元B轮融资，部分募集资金将用于生产硅基氮化镓电子电力外延产品，为本次技术突破奠定了基础。资料显示，苏州汉骅半导体成立于2017年11月，致力于化合物半导体核心材料的研发及产业化；其硅基氮化镓电力电子外延产品覆盖了增强型外延和耗尽型外延全应用领域，适用于30伏至900伏，并广泛应用于快充、无人机、数据中心等领域。本文发自【行家说三代半】，专注第三代半导体（碳化硅和氮化镓）行业观察。其他人都在看：王垚浩博士：南砂晶圆SiC的追赶与突围之路春节SiC迎开门红，8家企业官宣大事件罗姆（上海）董事长：全球库存调整告终，SiC/GaN迎来增长新周期","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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