蔚来芯片敲定百亿融资自研芯片赛道博弈升级

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作者/ 刘伟出品/ 灼见汽车2026年2月26日，蔚来旗下芯片子公司安徽神玑技术有限公司敲定首轮股权融资，22.57亿元资金全额到账，投后估值突破百亿元。合肥国投等地方国资联合IDG资本等市场化机构战略入股，融资完成后蔚来持股62.7%巩固绝对控股权，27.3%股权由外部投资者持有，剩余10%划转至管理股权激励实体。这是蔚来自2021年布局芯片自研以来首次向资本市场释放芯片业务股权，也是中国车企...

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灼见汽车2026年2月26日，蔚来旗下芯片子公司安徽神玑技术有限公司敲定首轮股权融资，22.57亿元资金全额到账，投后估值突破百亿元。合肥国投等地方国资联合IDG资本等市场化机构战略入股，融资完成后蔚来持股62.7%巩固绝对控股权，27.3%股权由外部投资者持有，剩余10%划转至管理股权激励实体。这是蔚来自2021年布局芯片自研以来首次向资本市场释放芯片业务股权，也是中国车企...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2026022821293997a773d4&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"09866","symbol_name":"蔚来-SW","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2026022821293997a773d4&s=b","article_id":"2614812855","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2026022821293997a773d4&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, 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灼见汽车2026年2月26日，蔚来旗下芯片子公司安徽神玑技术有限公司敲定首轮股权融资，22.57亿元资金全额到账，投后估值突破百亿元。合肥国投等地方国资联合IDG资本等市场化机构战略入股，融资完成后蔚来持股62.7%巩固绝对控股权，27.3%股权由外部投资者持有，剩余10%划转至管理股权激励实体。这是蔚来自2021年布局芯片自研以来首次向资本市场释放芯片业务股权，也是中国车企分拆核心芯片业务完成规模化融资的里程碑事件。资本加持下，这家成立仅八个月的企业迅速跻身汽车半导体赛道焦点。这场融资背后是蔚来五年造芯的技术攻坚与商业验证。2021年蔚来组建芯片研发攻坚团队，由曾任职于OPPO和小米的白剑领衔，从激光雷达主控芯片切入研发，完成技术验证。2023年10月首款自研芯片量产落地，2025年3月神玑NX9031作为全球首颗车规级5纳米高阶智驾芯片正式装车应用。这颗集成超500亿个晶体管的芯片算力媲美四颗英伟达Orin-X芯片，自2024年投产后累计出货量突破15万套，已全面装配于蔚来全系车型。其异构众核资源池架构支持多任务并发处理，覆盖从感知到规控的全智驾场景，底层架构与算法的自主研发让蔚来彻底摆脱外部芯片技术掣肘。高投入是蔚来造芯之路的显著标签，也折射出车企自研芯片的行业共性成本困境。蔚来董事长李斌曾透露，芯片研发三年投入相当于一千座换电站建设成本，按单座换电站150万至300万元核算，蔚来在芯片领域直接投入已超数十亿元。这一数字背后暴露出2024年蔚来超3亿美元采购英伟达智驾芯片的现实压力。自研芯片落地实现成本骤降，单颗芯片使单车成本降低超万元，软硬件深度协同更构建起智驾系统持续迭代的差异化优势。此次引入外部资本本质是蔚来为芯片业务构建市场化成本分摊与回报机制，为持续研发投入注入资本动能。多元资本入局既是产业逻辑与资本逻辑的深度耦合，更是地方产业布局与企业战略的紧密绑定。合肥国资持续加码与当地集成电路产业布局形成战略呼应，蔚来芯片业务的量产能力与技术落地构成合肥完善半导体产业链的关键拼图。IDG资本等市场化机构与中芯聚源等产业资本的参与，正是看中车规级芯片赛道的巨大市场潜力。2025年中国车规级芯片市场规模已达905亿元，高阶智驾普及正推动5纳米高端芯片需求持续爆发。资本分层布局不仅为安徽神玑注入研发资金，更为其后续市场化拓展奠定基础。尽管当前订单主要来自蔚来体系，神玑已启动全面对外市场拓展，甚至探索具身机器人等新兴领域应用可能。蔚来造芯资本化运作是中国车企突破核心技术垄断的典型样本，也揭开了车企自研芯片赛道的激烈博弈。长期以来全球车规级芯片市场被国际企业垄断，高端制程芯片更是国内产业薄弱环节，2025年国产车规级芯片市场占有率仅约三成。蔚来通过车企自研模式推动5纳米车规级芯片量产上车，打破先进制程芯片海外垄断格局，为行业树立车企深度参与芯片研发的标杆。从行业视角看，蔚来此次举措重塑了车企与芯片产业的竞合关系。车企通过分拆芯片业务引入外部资本，厘清研发投入与商业化回报关系，推动其从整车配套成本中心向具备独立盈利能力的利润中心战略转型。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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蔚来芯片敲定百亿融资 自研芯片赛道博弈升级

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蔚来芯片敲定百亿融资自研芯片赛道博弈升级