日联科技最新公告：拟与SSTI共同出资设立控股子公司完善半导体检测设备布局

证券之星02-27

日联科技(688531.SH)公告称，公司拟与控股孙公司SCPL SEMICONDUCTOR TEST & INSPECTION PTE. LTD.共同出资设立赛美康半导体（无锡）有限公司，注册资本1,100万元，日联科技持股70%，SCPL持股30%。该投资将进一步开拓公司在高端半导体检测设备领域的业务布局，完善公司在半导体失效分析、缺陷检测等领域的产品线。同时，公司将利用自身制造和整合能力、国内人力资源和成本优势，赋能控股子公司运营管理。预计对公司本年度财务状况及经营成果不构成重大影响。

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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