传音预热超薄模块化智能手机，将亮相MWC 2026

IT之家02-25

IT之家 2 月 25 日消息，传音（TECNO）预热将在 MWC 2026 展示一款超薄模块化手机，该机背面配备磁吸触点，允许用户连接各种不同外设，让手机实现不同用途。IT之家参考官方预告图，该机整体厚度 4.9mm，手机背面造型类似苹果 iPhone Air，采用单摄设计。随附配件中提供了相机手柄 / 长焦镜头、游戏手柄、运动相机、移动电源（电池包）、挂绳等。不过值得一提的是，官方发布的两张...

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