博通(AVGO.US)押注3.5D/3D堆叠技术：剑指百万级AI芯片出货 2027年冲击数十亿美元规模

智通财经02-26

智通财经APP获悉，在人工智能算力需求持续攀升的背景下，博通(AVGO.US)正加速推进其新一代堆叠式AI定制芯片商业化进程。公司表示，基于这一堆叠封装技术，到2027年预计至少可销售100万颗芯片，潜在收入规模或达数十亿美元。博通定制芯片与产品营销副总裁Harish Bharadwaj在接受采访时表示，这一销售预期基于博通研发的3.5D/3D堆叠设计方案，将两块芯片裸片紧密叠加，从而显著提升芯片...

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