上峰水泥(000672.SZ)参股公司盛合晶微科创板上市申请通过审议

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智通财经APP讯，上峰水泥(000672.SZ)公告，公司参股公司盛合晶微首次公开发行股票并在科创板上市申请获得审议通过。盛合晶微是一家集成电路晶圆级先进封测企业，起步于 12英寸中段硅片加工，并进一步提供晶圆级封装(WLP)和芯粒多芯片集成封装等全流程的先进封测服务。

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