重磅！台积电加速扩张晶圆厂

半导体创芯网02-24

随着人工智能技术重塑全球各行各业，全球领先的芯片代工制造商台积电正加速在我国台湾地区推进晶圆厂建设与升级，以填补人工智能芯片需求爆炸式增长与现有产能之间的缺口，尤其要满足英伟达等人工智能领域龙头企业的订单需求。2026年初，我国台湾地区中北部至南部的多个台积电建设工地一片繁忙，重点推进A14、N2、A16等前沿逻辑工艺，以及CoWoS（芯片封装于晶圆基板上）等关键先进封装技术的研发与落地。这些扩建...

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