苹果 M5 Pro / Max 芯片封装前瞻，有望打破 14 核 CPU/40 核 GPU 限制

IT之家02-19

感谢IT之家网友 Domado 的线索投递！IT之家 2 月 19 日消息，苹果已官宣 3 月 4 日举办新品发布会，预计将推出搭载 M5 Pro 和 M5 Max 芯片的新款 MacBook Pro。本次芯片升级的核心亮点在于变革封装技术：苹果将放弃传统的 InFO 封装，转而采用台积电 2.5D 芯粒（Chiplet）设计。IT之家注：InFO 是苹果常用的一种封装技术，特点是很薄、成本相对较...

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芯粒（Chiplet）设计。IT之家注：InFO 是苹果常用的一种封装技术，特点是很薄、成本相对较低，适合手机和轻薄本。但随着芯片越来越大、越来越热，这种技术有点“包不住”了，限制了核心数量进一步增加。随着晶体管密度增加，单片架构的弊端日益显现，14 英寸 M4 Max 用户对此或许深有体会。由于 CPU 和 GPU 紧密相邻，高负载下会产生显著的“热串扰”现象：即 GPU 发热会直接导致 CPU 升温，反之亦然，且两者无法独立散热。此外，复杂的供电走线在狭小空间内极易产生信号干扰，导致电能难以从芯片边缘无损传输至中心区域，限制了性能释放。苹果的 M5 Pro 和 M5 Max 预计将迎来 M1 发布以来的最大技术变革，首次采用台积电 SOIC-MH 2.5D 封装技术。SOIC-MH 是台积电的一种先进芯片 3D 堆叠技术，就像把原本平铺在一张大饼上的配料（CPU / GPU），切开后重新精细地码放在一个盘子里，既保持了整体性，又让各部分互不干扰。而 2.5D 封装是一种把“积木”拼在一起的高级胶水技术，它不仅仅是把芯片平铺，而是在芯片和电路板之间加了一层“中介层”（Interposer），让这些芯粒之间能以极高的速度传输数据，仿佛它们本来就是一体的。SOIC-MH 技术通过将 CPU 和 GPU 拆解为独立的“芯粒”，并封装在同一个基板（Substrate）上来解决上述难题。这种物理隔离消除了热量和电气的相互污染，让 CPU 和 GPU 能够拥有独立的供电通道和散热环境。尽管物理上分离，但借助先进的互连技术，这些芯粒在逻辑上仍表现为一颗完整的芯片，保留了 SoC 架构低延迟、高响应的核心优势。架构分离还为苹果带来了巨大的成本优势。在传统模式下，若 M4 Max 的 GPU 部分存在缺陷，整颗芯片可能都需要降级甚至报废。而在芯粒架构下，苹果可以分级筛选（Binning）CPU 和 GPU 模块。这意味着，拥有完美 CPU 但 GPU 稍弱的模块可以灵活组合，无需因局部瑕疵而牺牲整体，从而大幅提升晶圆利用率，也为未来增加更多核心数量提供了经济上的可行性。值得注意的是，这项昂贵的先进封装技术将由 Pro 和 Max 系列独占，标准版 M5 芯片预计将继续使用传统的 InFO（集成扇出型）封装技术。得益于散热与抗干扰能力的提升，M5 Pro 和 M5 Max 有望突破前代产品的规格天花板。回顾 M3 Max 和 M4 Max，受限于旧有的封装技术，其规格一直被锁定在最高 14 核 CPU 和 40 核 GPU。随着 2.5D 芯粒设计的引入，苹果终于能够在新一代芯片中塞入更多的 CPU 和 GPU 核心，为专业用户提供更强劲的计算与图形处理能力，而无需担心过热降频。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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