打破HBM壁垒:三星zHBM与英特尔Z-Angle内存之争

物理微电子前沿...02-19

在人工智能与高性能计算需求持续攀升的背景下，高带宽内存正面临前所未有的技术挑战。传统HBM通过垂直堆叠DRAM芯片并利用硅通孔实现高速互连，但随着堆叠层数不断提高，散热瓶颈、信号完整性与制造复杂度问题日益凸显。进入2026年初，两家半导体巨头分别给出了不同方向的答案。Intel联合软银旗下SAIMEMORY展示了Z-AngleMemory原型，而Samsung Electronics则在...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2026021913032097a67d0c&s=b><strong>物理微电子前沿...</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>在人工智能与高性能计算需求持续攀升的背景下，高带宽内存正面临前所未有的技术挑战。传统HBM通过垂直堆叠DRAM芯片并利用硅通孔实现高速互连，但随着堆叠层数不断提高，散热瓶颈、信号完整性与制造复杂度问题日益凸显。进入2026年初，两家半导体巨头分别给出了不同方向的答案。Intel联合软银旗下SAIMEMORY展示了Z-AngleMemory原型，而Samsung Electronics则在...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2026021913032097a67d0c&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0321505868.SGD","symbol_name":"Schroder ISF Global Dividend Maximiser A Dis 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2026上首次公开“zHBM”的详细规格。尽管两者都围绕“Z轴”展开设计理念，但技术路径与目标侧重点明显不同。传统HBM的核心在于垂直堆叠，通过增加层数来提升容量和带宽。然而，当层数攀升至更高阶段后，热量难以有效向外扩散，芯片中部温度持续升高，影响稳定性与良率。Z-AngleMemory试图在结构上打破单纯垂直堆叠的限制。据公开资料显示，这种架构采用一定角度的立体排列方式，让存储单元在空间上形成类似斜向分布，从而缩短信号路径并为热量提供更多扩散通道。与传统直上直下的堆叠相比，这种“倾斜式”布局在封装阶段增加了复杂度，但理论上可改善功耗表现与热管理效率。英特尔方面强调，ZAM更适合与先进封装技术结合，例如与逻辑芯片进行更紧密的异构集成。通过改变芯片之间的连接角度，可以在保持高带宽的同时降低局部热点形成的概率。这种思路更偏向系统级优化，希望在不无限增加层数的情况下提升整体性能。对AI加速器而言，持续稳定的带宽输出往往比单纯容量提升更为关键。相比之下，三星提出的zHBM则是在既有HBM演进路线上的深化升级。作为HBM4之后的下一代方案，zHBM在维持垂直堆叠主框架的基础上，通过优化层间互连结构与电源分布网络，实现更高的数据传输速率与能效表现。三星披露的技术要点显示，其重点在于改进TSV布局与热传导路径，同时增强封装材料的导热性能，使高层堆叠在保持可靠性的前提下进一步扩容。与ZAM的结构重构相比，zHBM更像是在现有生态基础上的渐进式升级。两种方案在产业落地节奏上也存在差异。ZAM目前仍处于原型展示阶段，更多强调概念验证与未来可扩展性。zHBM则在规格层面已经相对清晰，目标是服务于下一代AI服务器与高性能GPU平台。三星依托自身在DRAM量产领域的经验，试图通过优化工艺流程缩短量产周期，而英特尔则强调与合作伙伴共同开发新型封装生态。从技术哲学角度看，ZAM代表的是对传统堆叠方式的结构性反思，通过改变空间几何形态来缓解物理极限带来的压力。zHBM则延续垂直堆叠路线，通过材料、互连和散热技术的综合提升来突破瓶颈。两条路径都围绕“Z轴”展开，但一个强调角度创新，一个强调纵向深化。随着AI模型规模不断扩大，对内存带宽与容量的需求呈指数级增长。无论是ZAM还是zHBM，核心目标都是在功耗、散热与性能之间取得更优平衡。未来几年内，哪种架构能够更快实现规模化生产、获得主流芯片厂商支持，将直接影响高带宽存储市场格局。可以预见，HBM的演进不会止步于单一路径。多样化的结构创新将成为行业常态。Z轴概念的提出，标志着内存架构设计从单纯追求堆叠层数，转向更立体、更系统化的优化思路。对于半导体产业而言，这场围绕空间结构展开的技术竞赛，才刚刚拉开序幕。源自：整理自网络，仅用于交流学习，侵删推荐阅读卡脖子技术之1————国内外光刻机水平差距介绍大幅提升速率的5G的关键性技术原理竟然这么简单！看完你就懂了5G网络为什么这么快？看完你就懂了中国芯片行业急缺 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