黄仁勋罕见“逐桌敬酒”

投行并购圈02-20

英伟达CEO黄仁勋上周亲自出面宴请合作伙伴的工程师团队，这一罕见举动凸显出下一代高带宽内存HBM4对这家AI芯片巨头的战略重要性。随着三星电子在HBM4竞赛中率先出货，SK海力士能否按时交付高性能产品，将直接影响英伟达今年下半年推出的新一代AI加速器Vera Rubin的市场表现。2月14日晚间，黄仁勋现身英伟达总部附近的一家韩式炸鸡餐厅，花费约两小时为30多名SK海力士和英伟达工程师逐桌调制烧啤...

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TB/s以上\"的规格要求，较竞争对手AMD的同类要求高出30%以上。行业分析师认为，黄仁勋的亲自现身提升了SK海力士维持HBM4最大供应商地位的可能性。据行业消息人士透露，英伟达去年12月初步分配了今年的HBM供应份额，SK海力士获得55%以上，三星电子占20%多至接近30%，美光科技约20%。虽然三星在技术竞赛中的推进引发了份额变动的可能，但业内普遍认为SK海力士有望在第一季度完成质量优化后确保最大配额。罕见的\"工程师外交\"半导体行业将黄仁勋亲自为合作伙伴工程师举办晚宴视为高度不寻常的举动。这场聚会是黄仁勋上周临时指示英伟达员工\"组织一场晚宴鼓励SK海力士HBM工程师\"后迅速安排的，凸显SK海力士的HBM4对英伟达未来业务的关键性。黄仁勋于当晚5点20分左右抵达位于圣克拉拉的99 Chicken餐厅。在晚宴临近尾声时的最后敬酒环节，他表示：\"AI加速器和HBM4代表了非凡的、世界上最具挑战性的技术。我为所有夜以继日工作的你们感到骄傲，我相信你们将交付卓越成果。\"他补充道：\"我知道HBM4和Vera Rubin的开发时间表很紧，但我相信你们。现在是SK海力士和英伟达共同向世界展示伟大的时刻。\"SK海力士于2020年7月以HBM2E（第三代）产品正式进入英伟达供应链，随后成为HBM3（第四代）和HBM3E（第五代）的事实上独家供应商，与台积电一起形成了被称为\"AI半导体三方联盟\"的紧密关系。技术门槛与时间压力HBM4被视为决定英伟达下一代AI加速器Vera Rubin性能表现的关键组件。Vera Rubin计划于今年下半年推出，HBM4作为一种通过堆叠12层先进DRAM芯片制成的高性能内存模块，负责及时向处理计算的GPU提供海量数据。英伟达对HBM4提出的规格要求远超竞争对手。其要求的运行速度和带宽指标比AMD对HBM4的要求高出30%以上，实际上将HBM4定位为Vera Rubin的关键差异化因素。与基本由SK海力士独霸的HBM3E市场不同，将于下半年全面开启的HBM4市场呈现出不同的竞争格局。三星电子于2月12日向英伟达出货了首批正式HBM4产品，成为行业首家，其产品运行速度达到11.7 Gbps（最高13 Gbps），带宽为3.3 TB/s。SK海力士目前已确保HBM4性能达到11.7 Gbps或以上，正在向英伟达批量供应付费样品，同时进行性能优化工作。行业预计SK海力士将在近期获得英伟达的正式\"批量供应\"批准。在晚宴上，黄仁勋敦促SK海力士工程师\"无延迟交付顶级性能的HBM4\"。这一表态被解读为对供应时间表的明确要求。HBM份额争夺战升温随着三星在HBM4技术竞赛中取得进展，今年的供应份额分配可能出现变动。不过业内普遍认为，SK海力士在第一季度完成质量优化后，仍有很大机会确保最大配额。一位半导体行业消息人士向媒体解释称：\"三家内存制造商的最终HBM4优化工作要到3月左右才能完成。最近还出现了一种趋势，即优先增加通用DRAM生产以提高盈利能力，而不是争夺HBM市场份额。\"据华尔街见闻此前文章，Evercore的调研还指出了产品代际演进的差异，一些业内人士强调了\"minor\"（小幅演进）和\"major\"（大幅演进）之间的区别。其中从H100到B100/B200被视为minor过渡，而到GB-Series机架级系统是major演进，从GB-Series到VR-Series是minor，但到Rubin Ultra的过渡伴随着集群规模从144扩大到576则是major升级。这场由黄仁勋亲自主持的晚宴，既是对长期合作伙伴的认可，也是对关键供应链环节的督促。对于SK海力士而言，能否在激烈竞争中保持领先地位，未来数月的执行力将是决定性因素。民营500强集团公司，控股多家上市公司，横跨钢铁，冶金化工，新材料，医药，航空航天等多个行业。寻估值50亿以上医药企业，200亿估值硬科技独角兽公司（也可出让上市公司控制权）沟通并购业务合作。详情请后台私信联系小编各位朋友，微信公众号改了新规则，这样很多朋友将看不到我们的文章。只有将我们公众号“设为星标”，我们才能第一时间出现在您的订阅列表里青岛国资再”收“上市公司 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