台积电放弃8寸晶圆代工市场，成熟制程权力版图重洗

半导体链脉02-15

点击蓝字关注我们在AI芯片与高速运算需求强劲带动下，先进制程与先进封装产能长期供不应求，台积电加速调整产能结构，将资源集中于3nm以下制程及CoWoS、SoIC等先进封装领域。在缺工、建厂成本攀升与工期拉长压力下，厂区空间与人力成为关键稀缺资源，促使台积电启动6寸与8寸成熟制程的结构性优化，降低部分成熟产能，并以“优化资源配置”为原则，将既有产线运用更具弹性，同时持续支援既有客户需求。供应链解读...

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关注我们在AI芯片与高速运算需求强劲带动下，先进制程与先进封装产能长期供不应求，台积电加速调整产能结构，将资源集中于3nm以下制程及CoWoS、SoIC等先进封装领域。在缺工、建厂成本攀升与工期拉长压力下，厂区空间与人力成为关键稀缺资源，促使台积电启动6寸与8寸成熟制程的结构性优化，降低部分成熟产能，并以“优化资源配置”为原则，将既有产线运用更具弹性，同时持续支援既有客户需求。供应链解读，台积电并非全面退出成熟制程，而是将8寸业务转为策略性支援角色，透过产能整并与设备出售，逐步将成熟制程重心外移。在此架构下，世界先进成为最大受惠者。IC设计业者认为，台积电8寸年产能约500万片，未来约八成将透过转单、设备移转与技术合作等方式，分阶段交由世界先进承接。台积电近年已两度出售8寸设备予世界先进，并进行氮化镓（GaN）技术授权，使其同时具备GaN-on-Si与GaN-on-QST制程平台。世界先进目前在台湾与新加坡共设有五座8寸晶圆厂，2025年平均月产能约28.6万片。市场预估，随着台积电产能与设备陆续到位，未来数年世界先进8寸年产能有望较现阶段倍数成长，市占率同步提升，跃升为全球重要的8寸晶圆代工供应商。另一方面，成熟制程市场也同步升温。市场盛传世界先进因产能持续满载，规划4月起调涨部分产品代工报价，涨幅达15%。虽然公司未正面评论，但财报会上已释出需求转强、供需趋紧的讯号。供应链指出，由于AI服务器与高效能运算设备功耗快速攀升，带动电源管理IC、驱动IC与功率元件需求放大，而多数产品仍以8寸成熟制程为主要生产平台，使产能利用率维持高档。叠加材料与设备成本上涨、扩产投资压力增加，成熟制程厂陆续与客户协商调整价格。在市场上，力积电已规划3月调升8寸晶圆代工价格；联电则强调定价纪律与产品组合优化，并预估2026年成熟制程市场仍有1%至3%的温和成长。外界预期，若世界先进启动新一轮调涨，联电与力积电跟进机率高，成熟制程报价上行循环可望延续。推荐阅读8寸晶圆突然“翻身”！5%-20%涨价潮全面引爆被动元件厂1月火力全开，业绩全面飘红！Counterpoint ：第一季内存价格已经上涨了 80%~90%智能手机零件涨价，全球手机厂商正被迫调整产品布局MLCC被动元件的“涨价列车”再次启动CAGR 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