Tower高塔半导体：英特尔有意终止双方晶圆代工制造合作

爱集微02-13

模拟芯片代工企业 Tower Semiconductor 高塔半导体在当地时间本月 11 日公布 2025 年第 4 季度与全年业绩的新闻稿中提到，英特尔有意终止双方在晶圆代工制造上的合作，双方目前正处于调解过程中。英特尔此前提议收购 Tower，不过这笔交易在 2023 年 8 月最终告吹。在那之后的 2023 年 9 月，双方达成了一项晶圆代工合作：Tower 将利用英特尔美国新墨西哥州 ...

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