苹果芯片，选择Chiplet？

半导体行业观察02-14

得益于台积电全新的“小外形集成电路”（SoIC）封装技术， M5 Pro 和 M5 Max 有望成为苹果首批采用独立 CPU 和 GPU 模块的SoC ，从而为苹果便携式 Mac 电脑带来更多可能性。从提高良率降低制造成本到获得全新性能水平，这些都是企业转向芯片组设计后能够获得的诸多优势。但如果真是如此，为什么高通至今仍未采用这项技术呢？我们在下文中探讨了一些可能性，但我们也认为，高通最终必然会...

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电脑带来更多可能性。从提高良率降低制造成本到获得全新性能水平，这些都是企业转向芯片组设计后能够获得的诸多优势。但如果真是如此，为什么高通至今仍未采用这项技术呢？我们在下文中探讨了一些可能性，但我们也认为，高通最终必然会...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260214094515a6f9a8a9&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0289961442.SGD","symbol_name":"SUSTAINABLE GLOBAL THEMATIC PORTFOLIO \"AX\" (SGD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260214094515a6f9a8a9&s=b","article_id":"2611197657","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260214094515a6f9a8a9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, 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CPU 和 GPU 模块的SoC ，从而为苹果便携式 Mac 电脑带来更多可能性。从提高良率降低制造成本到获得全新性能水平，这些都是企业转向芯片组设计后能够获得的诸多优势。但如果真是如此，为什么高通至今仍未采用这项技术呢？我们在下文中探讨了一些可能性，但我们也认为，高通最终必然会完成这一转型。如果像骁龙 X2 Elite Extreme 这样的芯片组成为常规做法，高通最终将不得不转向小芯片设计。随着芯片的复杂性和物理尺寸不断增加，像苹果这样的公司正在转向芯片组（chiplet）设计以更好地适应这些变化。AMD 已经采用这种架构好几代了，英特尔的 Panther Lake 系列 也实现了类似的功能。然而，高通的骁龙 X2 Elite Extreme 和骁龙 X2 Elite却没有采用这种架构，这可能有几个原因。首先，这家圣地亚哥公司目前仅推出了第二代基于ARM架构的笔记本电脑SoC，而将多个芯片堆叠在单个芯片上需要大量的研发工作，更不用说还需要精湛的工程技术。根据Reddit上的讨论来看，这其中也包含大量的试错过程，这意味着高通可能需要数年时间才能推出一款采用芯片组设计的骁龙产品。再者，正如上文所述，随着芯片物理尺寸的增加，如果高通打算推出骁龙 X3 Elite Extreme，就必须迅速行动，否则它将在整整一代产品中落后于竞争对手。由于额外的功耗需求，高通可能会避免采用芯片组设计。提醒读者，骁龙 X2 Elite Extreme在无限制运行时功耗可超过 100W，而当多个芯片相互通信时，则需要额外的电力。高通可能出于优先考虑效率和散热的考虑而避免采用这种设计，因为采用芯片组架构意味着其合作伙伴也必须重新设计散热方案，这将导致笔记本电脑更加笨重。然而，如果芯片组设计存在高温隐患，苹果为何还要在 M5 Pro 和 M5 Max 中采用这种设计呢？这家位于库比蒂诺的公司与高通公司截然不同，它凭借对架构改进和效率的精湛掌控，开发出功耗最低、性能强大的 SoC，从而实现了便携式 Mac 电脑创纪录的超长续航时间。如果这家科技巨头的 M5 Pro 和 M5 Max 采用了芯片组设计，那就意味着该公司已经解决了散热问题。A19 Pro 就是一个很好的例证，它的能效核心不仅能带来高达 29% 的性能提升，而且这款 SoC 还能在零功耗的情况下实现这一壮举。最近的基准测试表明，高通骁龙 X2 Elite 处理器存在性能瓶颈，这使得芯片组设计方案极具可行性。初步评测显示，骁龙 X2 Elite 芯片组在 CPU 性能方面表现出色， 在大多数基准测试中都超越了 M5 。然而，在游戏性能方面，其弱点就显露出来了。诚然，骁龙 X2 Elite比骁龙 X Elite 强得多，但与 M5 相比仍处于另一个层次，这表明由于高通目前的集成显卡设计，集成显卡成为了性能瓶颈。如果你看看我们对英特尔酷睿Ultra X9 388H的评测，你会发现它的图形性能得益于新的架构，而这最终也是高通要想在这场竞争中保持竞争力需要采取的方向。（来源：编译自wccftech）*免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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