光弘科技：公司目前并未从事芯片封装相关业务

证券之星02-12

证券之星消息，光弘科技(300735)02月12日在投资者关系平台上答复投资者关心的问题。

投资者提问：贵司封装技术位于EMS行业领先地位，请问目前封装这块采用了哪些新技术？后续在芯片封装领域是否会介入？

光弘科技回复：尊敬的投资者，您好！公司是专业的EMS（电子制造服务）供应商，目前并未从事芯片封装相关业务。感谢您的关注，谢谢！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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