日月光首条CoWoS生产线，今年底亮相

半导体新知道02-09

全球AI芯片需求爆发，让先进封装成为比黄金还稀缺的资源。台积电CoWoS产能持续紧张，即便2026年月产能预计翻倍至13万片，仍无法满足客户需求。有供应链消息称，全球半导体封测龙头日月光投资176亿新台币，正在高雄K18厂区秘密建置首条类CoWoS-L封装产线，目前正与博通、超微等潜在客户进行验证，最快2026年底会有结果，力拼2027年进入量产。这一布局不仅瞄准台积电的溢出订单，更是日月光的战略...

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