英伟达招聘高级内存工程师！

与非网02-12

NVIDIA 近期开始招聘工程师，以提高其 HBM（高带宽内存）的良率。这似乎是为了应对内存制造商对性能效率日益增长的需求，因为其下一代 AI（人工智能）超级芯片 Vera Rubin 计划于今年下半年量产，并将采用 HBM4（第六代高带宽内存），其单芯片内存容量是现有 GPU（图形处理器）的数十倍。不仅三星电子在春节假期后开始为 NVIDIA 量产 HBM4，SK 海力士预计也将在下个月开始出货...

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HBM4（第六代高带宽内存），其单芯片内存容量是现有 GPU（图形处理器）的数十倍。不仅三星电子在春节假期后开始为 NVIDIA 量产 HBM4，SK 海力士预计也将在下个月开始出货...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260212100444a6f12708&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1280957306.USD","symbol_name":"THREADNEEDLE (LUX) US CONTRARIAN CORE EQUITIES \"AUP\" (USD) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260212100444a6f12708&s=b","article_id":"2610824999","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260212100444a6f12708&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, 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AI（人工智能）超级芯片 Vera Rubin 计划于今年下半年量产，并将采用 HBM4（第六代高带宽内存），其单芯片内存容量是现有 GPU（图形处理器）的数十倍。不仅三星电子在春节假期后开始为 NVIDIA 量产 HBM4，SK 海力士预计也将在下个月开始出货。据半导体行业消息人士2月10日透露，NVIDIA 发布了高级内存工艺工程师的招聘信息。根据招聘信息，该职位将负责与内存供应商建立合作关系，并通过数据分析开展工艺改进工作。据业内人士透露，NVIDIA正在招聘一名高级内存工艺工程师（SE-MEM工程师），与内存供应商合作进行工艺改进工作。此职位表明 NVIDIA 有意与内存供应商三星电子和 SK 海力士的生产线进行深度合作。为了提升 HBM 的良率，NVIDIA 将与供应商共享数据，识别工艺中导致良率下降的薄弱环节，并共同提升量产效率和性能稳定性。此外，NVIDIA 还表示，将与内存供应商紧密合作，共同提升数据中心 ATE（自动测试设备）和系统级的性能、良率和可靠性。该职位旨在通过检测性能和散热性能、识别错误模式以及识别缺陷产品，从而提高将两家公司 HBM 集成到 NVIDIA AI 芯片中的整体良率。近期外媒报道显示，NVIDIA、OpenAI 和 Meta 在基于 NVIDIA Blackwell GPU 构建和优化 AI 服务器方面遇到了困难。据报道，此次问题并非芯片本身性能问题，而是由于操作流程的复杂性所致。据悉，正在建设人工智能数据中心的甲骨文公司因此损失了约1400亿韩元。因此，内存半导体与人工智能芯片的集成预计将在未来变得日益重要。虽然每个NVIDIA Rubin GPU包含8个HBM4芯片，但下一代人工智能超级芯片Vera Rubin则使用了72个Rubin GPU。这意味着仅一个Vera Rubin芯片就包含576个HBM4芯片。随着数百个HBM芯片被安装在单个芯片上，内存供应商与NVIDIA之间的合作预计将会更加紧密。据报道，SK集团董事长崔泰源在访问美国期间，与NVIDIA首席执行官黄仁勋在加州圣克拉拉的99 Chicken餐厅共进炸鸡和啤酒。据信，双方讨论了包括HBM4供应计划、下一代服务器内存模块（SOCAMM）和NAND闪存在内的多种存储半导体。此外，从这些招聘信息来看，两家公司的HBM4出货似乎指日可待。据业内人士透露，三星电子预计将在本月第三周，即农历新年假期后开始量产HBM4。SK海力士也在近期发布的NDR报告中宣布，将于“今年第一季度开始向客户供货”。这意味着最迟下个月就会开始出货。产能预计也将扩大。三星电子近期宣布计划在明年第一季度前，在其平泽工厂新建一条1c DRAM生产线，即4号线（P4），月产能为10万至12万颗。 SK海力士预计将通过将其清州M15x生产线改造为专用的HBM 1b DRAM生产线，确保每月8万至9万颗的产能。据半导体分析公司Semianalysis称，美光预计将几乎完全退出英伟达的HBM4供应市场，SK海力士和三星电子将分别占据70%和30%的市场份额。芯片说——知识星球欢迎您","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"executive","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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