联发科天玑SoC交由英特尔代工：史上首次

快科技02-10

快科技2月10日消息，据媒体最新报道，联发科天玑系列芯片将交由英特尔代工，这一消息在半导体行业引发了广泛关注。在苹果初步敲定使用英特尔18A工艺后，英特尔似乎又争取到了第二大客户联发科，后者预计将采用英特尔14A工艺。众所周知，苹果可能会选择英特尔的18A-P工艺用于入门级M系列芯片，这颗芯片最快会在2027年出货。不止于此，苹果预计在2028年推出的定制化ASIC将采用英特尔的EMIB封装技术。...

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