力成押注FOPLP，赌对了

半导体产业纵横02-09

台积电产能吃紧，力成FOPLP成重要替代。力成科技于2 月 2 日举办年会，两大 FOPLP（扇出型面板级封装）客户博通与AMD均派出高层到场支持。不仅如此，据报道，现场还有来自日本的迪思科（Disco）、爱德万测试（Advantest）等设备厂商参会，并为力成定制化打造 FOPLP 生产线，显示其在先进封测领域的布局已获得产业链高度认可。作为全球较早布局 FOPLP 技术的封测企业，力成自 ...

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FOPLP（扇出型面板级封装）客户博通与AMD均派出高层到场支持。不仅如此，据报道，现场还有来自日本的迪思科（Disco）、爱德万测试（Advantest）等设备厂商参会，并为力成定制化打造 FOPLP 生产线，显示其在先进封测领域的布局已获得产业链高度认可。作为全球较早布局 FOPLP 技术的封测企业，力成自 ...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0094547139.USD","symbol_name":"abrdn SICAV I - GLOBAL SUSTAINABLE EQUITY FUND \"A\" (USD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b","article_id":"2610639154","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260209183326a6e5c4df&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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(USD) ACC","TSMU":"2倍做多TSM ETF-GraniteShares"},"translate_title":"Licheng bets on FOPLP, the bet is right","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"TSMU":0.6,"NVDA":1.64,"TSM":1.77,"03145":0.6,"TSMX":0.6,"TSMZ":0.6,"AVGO":1.71,"AUO":1.61,"MU":1.67,"AMD":1.71,"TSMY":0.6,"TSMG":0.6,"STSM":0.6,"HBM":0.73},"content_text":"台积电产能吃紧，力成FOPLP成重要替代。力成科技于2 月 2 日举办年会，两大 FOPLP（扇出型面板级封装）客户博通与AMD均派出高层到场支持。不仅如此，据报道，现场还有来自日本的迪思科（Disco）、爱德万测试（Advantest）等设备厂商参会，并为力成定制化打造 FOPLP 生产线，显示其在先进封测领域的布局已获得产业链高度认可。作为全球较早布局 FOPLP 技术的封测企业，力成自 2016 年启动相关研发与产线建设，历经近十年技术迭代与工艺优化，逐步完成从实验室验证到小批量试产的过渡，此次产业链核心伙伴集体到场，也标志着其技术路线与量产能力获得头部客户与设备端的双重认可。针对市场对AI 是否出现泡沫的担忧，力成董事长蔡笃恭强调：“在我个人看来，这一轮 AI 应用与算力需求才刚刚起步，距离行业过热还有相当大的距离。” 他进一步表示，无论是先进工艺还是先进封装，当前均处于供不应求状态，未来需求还将持续扩大。从行业基本面来看，AI 大模型参数规模持续攀升，多芯片异构集成成为主流架构，封装环节承担着芯片间高速互联、散热优化、尺寸控制等核心功能，成为制约算力集群效率的关键环节。目前能够大规模提供先进封装服务的厂商仍以台积电为主，而力成则定位为非台积电阵营的重要替代选择，重点承接因台积电产能饱和而外溢的高端封装需求。蔡笃恭表示，2026、2027 年资本开支均将接近 400 亿元，主要用于 FOPLP 产线扩建、工艺设备采购与研发投入，希望 FOPLP 等先进封测业务成为公司另一大核心增长动力。根据公司规划，其 510mm × 515mm 规格 FOPLP 产线月产能目标为 6000 片，若该产能于 2028 年全部建成并实现满产，单月营收贡献有望超过 30 亿元，预计占公司总营收比例将达到 20% 至 30%，彻底改变公司以存储封测为主的收入结构。过去市场对力成科技的固有印象，大多停留在“全球最大存储芯片封测厂”，长期聚焦 DRAM、NAND Flash 等存储器件的封装与测试服务，客户覆盖美光、铠侠、Solidigm 等国际存储大厂。但如今力成正以先进封装厂商的全新定位，成功获得国际一线客户的认可。当前台积电先进封装产能紧张，大部分被英伟达锁定，高端 AI 芯片、GPU、网络交换芯片的封装订单出现明显外溢，也让力成迎来难得的市场机遇。博通、AMD等客户从一年多前便主动洽谈合作，围绕AI 运算芯片、网络芯片开展 FOPLP 方案开发，并于近期正式进入 NRE（一次性工程设计费用）阶段，为后续大规模量产奠定基础。在AI 需求快速增长的带动下，芯片大厂纷纷加大先进封装布局力度，2.5D/3D 封装、扇出型封装、面板级封装等技术路线并行发展。力成选择投入大量时间与资源，与客户共同开发 FOPLP 产品，甚至暂缓了此前布局已久的 HBM 封装业务，集中资源突破面板级扇出封装的工艺瓶颈。对力成而言，过去十年的技术研发历经波折，早期因市场需求不成熟、工艺良率爬坡缓慢等因素，未能快速实现商业化落地，如今随着 AI 芯片集成度提升与大尺寸封装需求爆发，终于迎来转机。目前市场主流先进封装技术仍是台积电采用硅中介层的CoWoS‑S，但该架构在尺寸拓展、生产成本与量产效率方面存在一定限制，难以满足超大尺寸芯片与低成本规模化量产需求。因此台积电也在持续推进以重布线层（RDL）替代部分硅中介层的 CoWoS‑R，以及采用多颗硅桥（Bridge Die）连接的 CoWoS‑L，后两种架构的技术本质，与力成长期布局的无硅基板面板级封装工艺（PLP）十分接近，均侧重通过 RDL 层与硅桥实现芯片间高密度互联，这也为力成技术对接主流高端封装需求提供了可行性。过去，力成的工艺路线与CoWoS‑S 架构存在差异，导致应用场景受限，难以充分发挥自身优势；但随着 AI 芯片性能不断提升，封装内部需要整合更多计算芯片、存储芯片与接口模块，采用硅桥（Bridge Die）替代传统中介层的工艺路线，在成本、集成度与布线灵活性上更具优势，恰好是力成长期深耕并具备竞争力的技术方向。同时，FOPLP 采用面板级制程，单面板可同时处理多颗芯片，生产效率显著高于传统晶圆级封装，单位成本更具竞争力，适配 AI 芯片规模化量产需求。当前最热门的产品仍是HBM（高带宽存储）。由于 AI 服务器与算力集群需求爆发，HBM 需求极为旺盛，头部存储厂商优先调配产能保障 HBM 产出，反而挤占了其他存储产品的产能，导致整体存储芯片供应偏紧，这一状况短期内仍将持续。至于原厂扩产 HBM，无论在设备、工艺还是良率爬坡方面都需要较长周期，短期内难以完全匹配市场需求。力成虽具备成熟的 HBM 封装经验，但目前相关产能已优先转向支持 FOPLP 业务扩张，暂时没有多余产能直接投入 HBM 封装，待 FOPLP 产线稳定后再视市场情况调整产能分配。力成也是美光最大的后段封测代工合作伙伴，双方在存储封测领域合作多年，合作范围覆盖DRAM、NAND 等主流产品。随着美光在台湾地区、新加坡等地积极扩产，外界关注双方是否会进一步深化合作，拓展至先进封装领域。对此，蔡笃恭表示，目前仍处于敏感阶段，需要再观察一段时间，待市场环境与合作条件成熟后再对外说明。此外，力成本年已完成两处新厂区扩建，包括收购友达一座大型厂房，专门用于FOPLP 先进封装产能扩充，以及测试事业群新增一座厂区，提升高端芯片测试能力。这两座新厂的产能规模，基本可以支撑力成未来两年的增长需求，同时厂房设计与基础设施预留了灵活升级空间，后续可根据市场需求快速导入 HBM 相关封装与测试产能，平衡存储封测与先进封装业务发展。从行业发展趋势来看，先进封装已成为半导体产业技术竞争的核心领域，面板级扇出封装凭借高集成度、低成本、大尺寸适配等优势，逐步成为AI 芯片、网络芯片、高性能计算芯片的重要封装选择。力成科技凭借十年技术积累与产业链协同优势，抓住台积电产能饱和与先进封装需求爆发的窗口期，推动 FOPLP 技术商业化落地，不仅实现自身从存储封测向综合先进封装厂商的转型，也为全球先进封装产业提供了多元化的产能供给选择，对优化 AI 算力基础设施供应链、推动先进封装技术迭代具有积极意义。*声明：本文系原作者创作。文章内容系其个人观点，我方转载仅为分享与讨论，不代表我方赞成或认同，如有异议，请联系后台。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":2,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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