Tower与NVIDIA合作推出1.6T光模块加速AI基础设施部署

讯石光通讯网 02-09

2026年2月5日美国东部时间上午6:30 – 高价值模拟半导体解决方案领先代工厂Tower Semiconductor（纳斯达克/特拉维夫证券交易所代码：TSEM）今日宣布，正通过高性能硅光子技术扩展AI基础设施部署，该技术用于为NVIDIA网络协议设计的1.6T数据中心光模块。Tower Semiconductor的硅光子技术能够提供高达先前硅光子解决方案两倍的数据速率，为光互连带来更高的带宽...

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Shainer表示：“AI的指数级增长正推动对新型高速、可扩展网络的需求，以连接AI基础设施。NVIDIA正与Tower Semiconductor合作推进生态系统，通过下一代硅光子技术实现更高效的AI基础设施，并加速大规模AI应用。”  Tower Semiconductor的硅光平台针对高速光互连进行了优化，这使其成为AI基础设施、数据中心网络和先进电信领域市场领先公司的理想代工合作伙伴。  关于Tower Semiconductor  Tower Semiconductor Ltd.是高价值模拟半导体解决方案的领先代工厂，为消费、工业、汽车、移动、基础设施、医疗、航空航天和国防等增长市场的客户提供技术、开发和工艺平台。Tower Semiconductor专注于通过长期合作伙伴关系及其先进创新的模拟技术产品，对世界产生积极和可持续的影响。其技术产品包括广泛的可定制工艺平台，如SiGe、BiCMOS、混合信号/CMOS、RF CMOS、CMOS图像传感器、非成像传感器、显示器、集成电源管理（BCD和700V）、光子学和MEMS。Tower Semiconductor还提供世界一流的设计支持服务，以实现快速准确的设计周期，并为IDM和无晶圆厂公司提供工艺转移服务，包括开发、转移和优化。为了为客户提供多晶圆厂采购和扩展产能，Tower 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Tower与NVIDIA合作推出1.6T光模块 加速AI基础设施部署

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Tower与NVIDIA合作推出1.6T光模块加速AI基础设施部署