三星将率先量产HBM4：抢下AI存储的"下一张门票"

华尔街见闻02-08

据悉三星HBM4量产和出货时间定在本月第三周，即农历新年假期后立即启动。三星在上一代HBM3E产品上曾遭遇挫折，此次抢先量产HBM4被视为重夺市场主动权的关键一步。三星电子将在农历新年假期后率先启动全球首次HBM4大规模量产和出货，这款面向人工智能芯片的新一代高带宽存储器性能居行业之首。此举标志着三星试图在新一代AI存储市场确立主导地位，并弥补上一代产品的市场失地。据行业消息人士透露，三星电子已将...

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href=https://wallstreetcn.com/articles/3765248><strong>华尔街见闻</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>据悉三星HBM4量产和出货时间定在本月第三周，即农历新年假期后立即启动。三星在上一代HBM3E产品上曾遭遇挫折，此次抢先量产HBM4被视为重夺市场主动权的关键一步。三星电子将在农历新年假期后率先启动全球首次HBM4大规模量产和出货，这款面向人工智能芯片的新一代高带宽存储器性能居行业之首。此举标志着三星试图在新一代AI存储市场确立主导地位，并弥补上一代产品的市场失地。据行业消息人士透露，三星电子已将...</p>\n\n<a 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2026大会上首次展示搭载三星HBM4的Vera Rubin产品。这一进展对AI芯片供应链具有直接影响，将改变高端存储器市场的竞争格局。性能指标全面领先行业标准三星电子的HBM4在性能上实现了对行业标准的大幅超越。从研发之初，三星就将目标设定为超越JEDEC（固态技术协会）的性能标准，为此同时采用了1c DRAM工艺和4纳米晶圆代工工艺。凭借这一工艺组合，三星HBM4的数据处理速度达到11.7 Gbps，超出JEDEC标准8 Gbps约37%，较上一代HBM3E的9.6 Gbps快22%。单堆栈存储带宽达到3 TB/s，是上一代产品的2.4倍。采用12层堆叠技术可提供36 GB容量，未来若采用16层堆叠，容量可扩展至48 GB。该产品在提升计算性能的同时采用低功耗设计，有望帮助数据中心降低电力消耗和制冷成本。产能扩张应对需求激增市场条件对三星有利。三星电子预计今年HBM销量将较去年增长两倍以上，并已决定在平泽园区第四工厂安装新生产线以扩大产能。三星凭借其作为全球唯一同时具备逻辑芯片、存储器、晶圆代工和封装能力的企业地位，计划通过先进存储器和晶圆代工工艺的协同效应，以综合一站式解决方案提供商的身份最大化竞争优势。据行业消息人士称，\"三星电子拥有全球最大产能和最广泛产品线，通过率先量产性能最高的HBM4证明了其技术竞争力。\"该消息人士补充道，\"基于此，公司正处于引领市场的最有利位置。\"市场格局重塑在即此次量产时间表的落地，使三星在与SK海力士等竞争对手的角逐中占得先机。HBM4作为下一代AI加速器的关键组件，其供应能力将直接影响英伟达等芯片制造商的产品发布节奏和性能表现。三星最新采购订单中用于客户成品模块测试的HBM4样品数量据信也大幅增加，显示其在主要客户供应链中的地位正在强化。这对投资者评估三星在高端存储器市场的竞争力具有参考意义。","kind":"highlight","is_publish_news":true,"is_publish_highlight":true,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":2,"commentSize":0,"repostSize":1,"favoriteSize":2,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; 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