联发科率先采用台积电2纳米和14A

半导体行业观察02-07

AI浪潮快速席卷全球，半导体产业结构正出现关键转折。芯片大厂联发科总经理暨营运长陈冠州指出，AI对算力、功耗与系统整合的高度需求，正全面推升先进制程与先进封装的重要性，联发科持续深化与台积电合作，在2纳米及A14制程都是首批采用客户。先进封装部分亦在COUPE（紧凑型通用光子引擎）平台助攻下，持续推进3.2T硅光子引擎。AI已从早期的感知型应用，快速进入生成式与自主式阶段，未来两至三年将进一步迈向...

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ASIC产品线，与多家云端服务供应商（CSP）深化合作，逐步建立资料中心长期成长引擎。至于与英伟达合作，双方将聚焦于低功耗、高算力的SOC设计，陈冠州预留伏笔，表示在Computex将有机会看到新的进展。针对外界关注的手机市场，联发科坦言，存储价格上涨将对2026年手机需求形成逆风，特别是中低阶产品压力较大。不过，陈冠州认为，高阶与AI功能导入仍具支撑力，加上边缘AI、Agent应用逐步落地，手机使用体验将出现“从0到1”的变化，长期仍具升级动能。https://www.ctee.com.tw/news/20260207700059-430502（来源：工商时报）*免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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