英特尔推出了业界首款采用EMIB先进封装的“玻璃核心”基板

中国粉体网02-07

中国粉体网讯近日，在东京国际展览中心举办的“NEPCON Japan 2026”电子制造及封装技术展览会上，英特尔首度公开展示集成嵌入式多芯片互连桥（EMIB，Embedded Multi-Die Interconnect Bridge）技术、尺寸达78mm×77mm的巨型玻璃芯基板原型。来源：英特尔相较于有机基板，玻璃基板凭借优异的固有特性，在先进封装等领域展现出不可替代的优势。其热膨胀系数（...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2609545665?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-02-07 11:33","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2609545665","market":"us","top_or_hot":-1,"title":"英特尔推出了业界首款采用EMIB先进封装的“玻璃核心”基板","media":"中国粉体网","content":"<div>\n<p>中国粉体网讯近日，在东京国际展览中心举办的“NEPCON Japan 2026”电子制造及封装技术展览会上，英特尔首度公开展示集成嵌入式多芯片互连桥（EMIB，Embedded Multi-Die Interconnect Bridge）技术、尺寸达78mm×77mm的巨型玻璃芯基板原型。来源：英特尔相较于有机基板，玻璃基板凭借优异的固有特性，在先进封装等领域展现出不可替代的优势。其热膨胀系数（...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260207113352a486d7e3&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>英特尔推出了业界首款采用EMIB先进封装的“玻璃核心”基板</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n英特尔推出了业界首款采用EMIB先进封装的“玻璃核心”基板\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-02-07 11:33 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260207113352a486d7e3&s=b><strong>中国粉体网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>中国粉体网讯近日，在东京国际展览中心举办的“NEPCON Japan 2026”电子制造及封装技术展览会上，英特尔首度公开展示集成嵌入式多芯片互连桥（EMIB，Embedded Multi-Die Interconnect Bridge）技术、尺寸达78mm×77mm的巨型玻璃芯基板原型。来源：英特尔相较于有机基板，玻璃基板凭借优异的固有特性，在先进封装等领域展现出不可替代的优势。其热膨胀系数（...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260207113352a486d7e3&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0321505868.SGD","symbol_name":"Schroder ISF Global Dividend Maximiser A Dis SGD","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260207113352a486d7e3&s=b","article_id":"2609545665","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260207113352a486d7e3&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2609545665","pubTimestamp":1770435218,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"英特尔该技术方案可在78毫米×77毫米的封装尺寸内，实现相当于两倍标准掩模版的面积。此次英特尔巨型玻璃芯基板原型的公开亮相，打破了外界对其玻璃基板技术“停滞研发”的猜测，标志着该技术已从实验室走向实际应用阶段。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0321505868.SGD":"Schroder ISF Global Dividend Maximiser A Dis SGD","LU0321505439.SGD":"Schroder ISF Global Dividend Maximiser A Acc SGD","BK4535":"淡马锡持仓","BK4515":"5G概念","04335":"英特尔-T","BK4612":"AI芯片","BK4579":"人工智能","BK4550":"红杉资本持仓","BK4588":"碎股","LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","BK4605":"半导体精选","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","BK4529":"IDC概念","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","LU2148611432.USD":"AZ ALLOCATION BALANCED BRAVE \"AAZ\" (USDHDG) ACC","INTC":"英特尔","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","BK4554":"元宇宙及AR概念","BK4602":"量子计算概念","LU2543165471.USD":"E FUND (HK) GLOBAL QUALITY GROWTH \"A\" (USD) ACC","BK4527":"明星科技股","BK4512":"苹果概念","BK4543":"AI","BK4141":"半导体产品","BK4534":"瑞士信贷持仓","BK4585":"ETF&股票定投概念","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0097036916.USD":"贝莱德美国增长A2 USD","BK4575":"芯片概念"},"translate_title":"Intel launches industry's first \"glass core\" substrate with EMIB advanced packaging","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"04335":1.95,"INTC":1.95},"content_text":"中国粉体网讯近日，在东京国际展览中心举办的“NEPCON Japan 2026”电子制造及封装技术展览会上，英特尔首度公开展示集成嵌入式多芯片互连桥（EMIB，Embedded Multi-Die Interconnect Bridge）技术、尺寸达78mm×77mm的巨型玻璃芯基板原型。来源：英特尔相较于有机基板，玻璃基板凭借优异的固有特性，在先进封装等领域展现出不可替代的优势。其热膨胀系数（CTE）可精准调控至3-4ppm/K，与硅芯片高度匹配，能大幅降低热循环过程中的热应力，有效抑制封装翘曲，解决有机基板因CTE失配导致的可靠性难题；此外，玻璃基板介电常数与介电损耗更低，能减少高频信号传输延迟与串扰，适配AI、HPC芯片的高频需求，同时高刚性可有效支撑超大尺寸封装，避免基板下垂变形，高热稳定性也更适配复杂封装工艺。英特尔该技术方案可在78毫米×77毫米的封装尺寸内，实现相当于两倍标准掩模版的面积。从垂直横截面来看，该方案采用10-2-10的叠层架构：包含10层重布线层、2层玻璃芯（厚芯）层以及10层底部重布线层/增层。即便采用如此高密度的叠层设计，依托玻璃优异的材料特性，该方案仍可实现高密度布线，这也是其核心优势。值得关注的是，英特尔已在该封装内部集成了两个嵌入式多芯片互连桥，用以实现多个计算芯片间的互连。来源:英特尔该封装的尺寸规格，以及明确标注的“无晶圆级再分布层（No SeWaRe）”标识表明，此方案专为服务器级产品设计，例如AI加速器。不难看出，此次展示的EMIB与玻璃基板整合方案，对于提升AI架构性能上限至关重要：玻璃材料可实现精细互连、更优的焦深控制，并降低机械应力。若要让AI芯片在单个“超级封装”内集成数十个芯片粒，英特尔的这一技术路径是极具可行性的优选方案之一。此次英特尔巨型玻璃芯基板原型的公开亮相，打破了外界对其玻璃基板技术“停滞研发”的猜测，标志着该技术已从实验室走向实际应用阶段。随着2026年成为玻璃基板商业化出货的关键节点，英特尔的这一技术路径或许将支撑其晶圆代工业务争夺AI加速器市场份额，为万亿参数AI模型、高性能计算等前沿领域的突破奠定坚实基础，引领先进封装技术从“晶体管小型化驱动”向“系统级整合驱动”的深刻转型。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2609545665","isCrawlerRequest":true}