蓝思科技：蓝思科技早在2023年便将TGV玻璃基板、HDD玻璃硬盘作为重点研发方向

证券之星02-06

证券之星消息，蓝思科技(300433)02月06日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘您好，请问公司有没有半导体玻璃基板，如有目前处于什么阶段

蓝思科技回复：投资者您好！蓝思科技早在2023年便将TGV玻璃基板、HDD玻璃硬盘作为重点研发方向，并作为主要起草单位参与了《3D封装玻璃通孔（TGV）工艺技术规范》团体标准的制定。目前正配合国内外头部客户推进相关产品开发验证工作，具体进度涉及商业保密义务，不便透露。相关业务还未产生收入，请投资者注意风险。谢谢您的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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