联瑞新材(688300.SH)：应用于M9级高性能电子电路基板的球硅产品，已与行业主流厂商形成深度合作

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格隆汇2月5日丨联瑞新材(688300.SH)在互动平台表示，公司应用于M9级高性能电子电路基板的球硅产品，已与行业主流厂商形成深度合作，并已形成小批量销售。同时，公司的Low α球铝作为先进封装的关键填料，销售呈较快增长趋势，已成为少数能量产供应该材料的厂商之一。

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