矩子科技：公司的3D SPI和3D AOI是PCB表面贴装环节的通用型设备

证券之星02-05

证券之星消息，矩子科技(300802)02月04日在投资者关系平台上答复投资者关心的问题。

投资者提问：董秘，您好！请问公司自研的3D SPI和3D AOI是否适用于于光通信领域，适用光模块线路板制程环节的检测?

矩子科技回复：尊敬的投资者，您好。公司的3D SPI和3D AOI是PCB表面贴装环节的通用型设备。感谢您的关注。

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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