苹果 Mac 芯片未来有望支持“基础款 CPU + 顶配 GPU”灵活配置

IT之家02-03

IT之家 2 月 3 日消息，科技媒体 Wccftech 昨日（2 月 2 日）发布博文，报道称苹果有望通过台积电的 SoIC-mH 封装技术，实现 CPU 与 GPU 的物理分离，可以根据用户需求，实现“基础款 CPU + 顶配 GPU”搭配。IT之家曾于 2 月 1 日报道，苹果调整 Mac 产品的购买界面。用户此前点击购买后会先看到一系列包含不同芯片、内存和存储组合的“预设机型”，通常只需...

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产品的购买界面。用户此前点击购买后会先看到一系列包含不同芯片、内存和存储组合的“预设机型”，通常只需从中挑选一款即可。新版界面移除了这些预设选项，直接将用户引导至全定制页面。现在，消费者必须从屏幕尺寸开始，逐一手动选择每一项硬件规格。该媒体认为苹果极少无故调整功能性 UI，此次改版暗示了新一代芯片将带来前所未有的硬件定制“精细度”，可以区分选择 CPU 和 GPU。目前的 M 系列芯片采用片上系统（SoC）设计，CPU 和 GPU 被紧密集成在同一块硅片上，导致两者的核心数必须按固定比例捆绑销售。如果用户想要最强的 GPU 图形性能，往往被迫为不需要的顶级 CPU 性能买单。而未来苹果有望区分 CPU 和 GPU，用户可以独立选配 CPU 和 GPU 核心数，例如满足特定专业需求，可以搭配“基础款 CPU + 顶配 GPU”。而在技术实现方面，苹果分析师郭明𫓹早前曾披露关键技术细节。他指出，M5 Pro 芯片将率先采用台积电最新的 SoIC-mH（集成芯片系统-水平成型）封装工艺。该技术不仅能实现更高的组件密度和更小的封装体积，非常适合 MacBook Pro 等对空间要求严苛的便携设备，还能通过暴露的散热焊盘显著提升热传递效率，确保持续的高性能输出。不同于传统的平面封装，SoIC 是一种 3D 封装解决方案，支持将多个芯片（Die）在垂直和水平方向上进行堆叠，最终集成为一个类似 SoC 的整体。得益于 SoIC 技术的引入，M5 Pro 和 M5 Max 芯片有望实现 CPU、GPU 和神经网络引擎等核心组件的独立裸片集成。这意味着用户在购买 Mac 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