天玑9600将于9月亮相：联发科首款2nm芯片，对标苹果A20

PConline太平洋...02-02

2月2日，台积电官网披露，其2nm制程工艺已按计划在去年第四季度正式量产，这也意味着手机行业即将迈入2nm技术新纪元。作为台积电的重要客户之一，联发科首款2nm旗舰芯片“天玑9600”已确定将于今年9月22日发布，性能直接对标同期苹果A20系列芯片，而后者将由iPhone 18系列首发搭载。图片来源：联发科技，下同据悉，联发科早在去年9月就已成功完成2nm芯片的设计流片工作，今年将正式进入大规模...

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18系列首发搭载。图片来源：联发科技，下同据悉，联发科早在去年9月就已成功完成2nm芯片的设计流片工作，今年将正式进入大规模量产阶段。相较于现有的N3E制程，台积电2nm制程技术在核心性能上实现显著提升：逻辑密度增加1.2倍，在相同功耗条件下性能提升18%，而在相同运行速度下功耗可降低约36%，将为终端设备带来更强劲的性能表现和更出色的续航体验。按照行业惯例，OPPO和vivo将成为天玑9600的首批搭载品牌，相关终端产品预计将同步在9月亮相，届时将与苹果iPhone 18系列展开正面市场竞争，为消费者带来更多高端旗舰选择。编辑点评：台积电2nm量产落地，联发科携天玑9600入局高端战场，与苹果A20正面抗衡。双雄对决+头部厂商加持，高端手机市场将迎来更具看点的技术比拼与选择空间。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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