苹果iPhone芯片或无缘英特尔先进工艺，散热问题成关键

爱集微02-02

近日，关于英特尔可能重回苹果阵营，为其部分M系列处理器和非Pro版iPhone芯片提供芯片的传闻引发广泛关注。然而，业内人士的最新观点已基本否定了苹果iPhone芯片采用英特尔先进制程工艺的可能性。过去几周，GF证券和DigiTimes等媒体均披露，苹果可能会选择英特尔的18A-P工艺用于其最低端的M系列芯片，预计将于2027年出货，以及用于非Pro版iPhone芯片，预计在2028年推出。GF...

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3D混合键合技术的节点，该技术通过TSV（硅通孔）堆叠多个芯片裸片。然而，与台积电不同的是，英特尔在其先进的18A和14A节点上全面采用了背面供电技术（BSPD），而台积电则提供了部分带有BSPD和部分不带BSPD的节点，以丰富其整体产品组合。尽管BSPD可以提供一定的性能提升，例如通过背面更短、更厚的金属路径为芯片供电，降低电压降，实现更高、更稳定的工作频率，同时释放正面布线轨道，从而提高晶体管密度或减少拥塞和布线长度，但对于移动芯片而言，这种方法带来的性能提升相当有限。更重要的是，这种方法会导致更严重的自热效应（SHE），需要为芯片提供额外的冷却。实际上，所需的散热器必须保持在“大约 20°C 以下，才能使BSPD在热点处达到相同的芯片温度（因为垂直热扩散很差，但横向更差，现在没有厚的硅衬底），而在许多依赖空气冷却或有最大允许外壳温度的应用中，这是根本不可能的。”（引自IanD在该线程中的评论）由于这些散热问题，业内人士认为，英特尔制造苹果iPhone芯片的可能性“几乎为零”，正如Jukan在其对X的评论中所强调的那样。当然，M系列处理器仍有可能采用英特尔的工艺。（校对/赵月）","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"-1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; 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