苹果芯片代工格局生变：台积电独占或终结英特尔有望入局代工

ITBEAR科技资讯02-04

自2016年起，台积电一直是苹果SoC系统级芯片的独家代工合作伙伴，然而，这一长达十年的合作关系或将迎来重大转变。据业内消息，苹果正考虑将部分低端处理器的生产任务交由台积电以外的厂商承担。消息人士透露，台积电近年来与英伟达等人工智能公司合作日益紧密，业务重心有所倾斜。在此背景下，苹果开始评估是否将部分非核心处理器的代工订单转移至其他供应商，以分散供应链风险。尽管目前尚未确定具体合作厂商，但市场普遍...

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market","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AAPX":0.6,"MACW.SI":0.6,"03145":0.6,"APLY":0.6,"04335":1.88,"AAPU":0.6,"AAPL":1.96,"AAPD":0.6,"AAPB":0.6,"AAPY":0.6,"INTC":1.88,"AAPW":0.6},"content_text":"自2016年起，台积电一直是苹果SoC系统级芯片的独家代工合作伙伴，然而，这一长达十年的合作关系或将迎来重大转变。据业内消息，苹果正考虑将部分低端处理器的生产任务交由台积电以外的厂商承担。消息人士透露，台积电近年来与英伟达等人工智能公司合作日益紧密，业务重心有所倾斜。在此背景下，苹果开始评估是否将部分非核心处理器的代工订单转移至其他供应商，以分散供应链风险。尽管目前尚未确定具体合作厂商，但市场普遍猜测英特尔可能成为主要候选者。海通国际证券分析师Jeff Pu此前预测，英特尔最早可能在2028年与苹果达成协议，为部分非Pro型号iPhone提供芯片。若合作顺利，英特尔有望参与未来iPhone A21或A22芯片的代工生产。除了移动设备芯片，苹果与英特尔的潜在合作还可能扩展至Mac和iPad产品线。分析师郭明𫓹曾表示，英特尔可能从2027年中期开始为特定型号的Mac和iPad供应最低端的M系列芯片，采用其18A制程工艺。不过，这一预测仅涉及Mac和iPad领域，未提及iPhone芯片合作。值得注意的是，英特尔在此次合作中的角色将严格限定为代工厂商，不参与芯片设计环节。这与苹果2020年前使用英特尔x86架构处理器的模式形成鲜明对比——当时英特尔不仅负责制造，还主导芯片设计工作。如今，苹果已全面转向自研芯片架构，仅需代工厂商完成生产环节。供应链多元化已成为苹果的重要战略方向。随着人工智能服务器对存储芯片需求激增，英伟达已取代苹果成为台积电最大客户。这一市场格局变化，进一步促使苹果寻求新的代工合作伙伴以保障供应链稳定。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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苹果芯片代工格局生变：台积电独占或终结 英特尔有望入局代工

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苹果芯片代工格局生变：台积电独占或终结英特尔有望入局代工