先进封装市场年增9.4%，2.5D/3D封装因AI需求迎爆发增长

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随着摩尔定律逼近物理极限，先进封装已取代传统制程微缩，成为驱动半导体性能提升和产业增长的核心引擎。由人工智能、数据中心及新架构主导的算力时代，正将封装技术从幕后推向产业价值创造的中心舞台。根据Yole的数据，先进封装市场正步入战略性增长新阶段，预计将以9.4%的年复合增长率扩张，到2030年市场规模将逼近800亿美元。其中，直接服务于AI与数据中心需求的2.5D/3D先进封装增长最为迅猛，预计在...

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