英伟达技术升级 PCB有望爆发

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点击↑红刊投服平台关注我设星标助力大盘请点最下方：点赞、分享、喜欢、留言事件催化：AI服务器使用的高阶CCL价值量是传统的5-7倍。一是AI服务器主板层数更多、面积更大；二是材料单价更高。AI推升行业景气度，上游高端材料面临供应紧缺。高速CCL正向M9升级，CCL升级换代围绕四大核心材料：电子布、HVLP铜箔、电子树脂、填料。随着英伟达正交背板需求、Cowop工艺升级，PCB价值量将稳步提升。...

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设星标助力大盘请点最下方：点赞、分享、喜欢、留言事件催化：AI服务器使用的高阶CCL价值量是传统的5-7倍。一是AI服务器主板层数更多、面积更大；二是材料单价更高。AI推升行业景气度，上游高端材料面临供应紧缺。高速CCL正向M9升级，CCL升级换代围绕四大核心材料：电子布、HVLP铜箔、电子树脂、填料。随着英伟达正交背板需求、Cowop工艺升级，PCB价值量将稳步提升。...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260128192304953ebcd9&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"3NVD.UK","symbol_name":"LS 3X NVIDIA","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260128192304953ebcd9&s=b","article_id":"2606718790","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260128192304953ebcd9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, 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设星标助力大盘请点最下方：点赞、分享、喜欢、留言事件催化：AI服务器使用的高阶CCL价值量是传统的5-7倍。一是AI服务器主板层数更多、面积更大；二是材料单价更高。AI推升行业景气度，上游高端材料面临供应紧缺。高速CCL正向M9升级，CCL升级换代围绕四大核心材料：电子布、HVLP铜箔、电子树脂、填料。随着英伟达正交背板需求、Cowop工艺升级，PCB价值量将稳步提升。名词解释：PCB是印制电路板，相当于电子产品的“接线枢纽+固定架”，让电流和信号顺畅传输，其质地直接影响电子产品的性能，所以被称作“电子产品之母”。行业空间：据Prismark数据，2024年PCB全球产值735.7亿美元，同比+5.8%，传统业务需求复苏缓慢，但AI领域服务器与交换机等需求强劲。2024-2029年全球服务器/数据存储PCB市场CAGR达18.7%，位列PCB所有应用领域第一；2026年AI专用PCB实现“量价齐升”。相关公司（非推荐）：高多层板沪电股份：覆盖英伟达GPU主板、谷歌ASIC载板及800G光模块背板。深南电路：无锡基地量产FC-BGA载板，国内唯一具备5nm芯片载板能力。HDI（高密度板）胜宏科技：英伟达DGX服务器主板核心供应商，国内唯一通过NV Delta Level认证。景旺电子：珠海+龙川基地扩产推动IC载板，正认证英伟达载板二供资格。FPC（柔性电路板）东山精密：发展英伟达服务器背板业务，HDI技术适配CoWoS封装需求。鹏鼎控股：已获英伟达Orin模组订单并向AI服务器延伸。其他生益电子：主营谷歌/亚马逊ASIC载板，ABF材料涂覆技术打破味之素垄断。方正科技：珠海基地布局高端HDI及载板产能，目标切入AI服务器供应链。世运电路：主营业务为各类印制电路板（PCB）的研发、生产与销售。四会富仕：主营业务为PCB的研发、生产与销售。广合科技：主营业务为印制电路板的研发、生产和销售。兴森科技：珠海基地2024年量产FC-CSP载板并送样英伟达Orin芯片。CCL（覆铜板）生益科技：全球第二大刚性覆铜板生产企业，全球市占率超过10%。金安国纪：印制电路板（PCB）产品广泛应用在消费电子、汽车电子、通讯等领域。南亚新材：产品是覆铜板、粘结片，直接供货至下游PCB客户。华正新材：产品覆铜板（CCL）全称覆铜箔层压板。电子布宏和科技：电子级玻纤纱线及织物主要用于印刷电路生产及制造。中材科技：自主研发的应用于高端PCB的第一代低介电产品获得国内知名客户。菲利华：石英电子布应用于高频高速覆铜板（CCL）的优选材料。国际复材：开发低气泡细纱，解决了高端PCB源头关键材料长期依赖进口的问题。特种树脂东材科技：生产的电子级树脂材料是制造印制电路板（PCB）的上游核心材料。钻针鼎泰高科：全球钻针市场份额25%，钻针业务占营收75%。铜箔铜冠铜箔：HVLP铜箔通过台光电认证，替代三井金属高频产品。德福科技：产品电子电路铜箔是制作覆铜板和PCB的重要基础原材料。设备大族数控：PCB钻孔设备国内市占率70%，钻孔密度技术领先。芯碁微装：直写光刻设备国产化加速，载板领域市占率从5%升至25%。东威科技：自主创新的垂直连续电镀方法已成为国产PCB电镀设备主流。文章内容来自公开信息以上内容能帮助您更清晰的了解产业链概况，有问题可以留言交流，多多点赞和转发，您的支持就是我们最大的动力，以后还有更多产业链与您分享。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"2","news_tag":"productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":1,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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