海力士选择调整HBM4产品设计，并重新申请英伟达认证

IT之家01-26

IT之家 1 月 26 日消息，北京时间今天凌晨，据韩媒 Alpha Economy 援引知情人士消息称，三星电子正在加速推进面向英伟达的 12 层堆叠 HBM4 高带宽内存量产准备，消息人士称英伟达的最终质量认证流程已经完成。三星电子 DS 部门已决定从 2 月起启动英伟达用 12 层堆叠 HBM4 的晶圆投片。报道称，该产品在去年底进入英伟达最终认证阶段，使三星电子在全球三大存储芯片厂商的进度...

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产品设计，并重新申请英伟达认证，显示高带宽内存市场的竞争仍在持续加剧。一位了解三星电子内部情况的消息人士表示，如果 12 层堆叠 HBM4 在无需修改设计的情况下顺利通过认证，那么从 2 月投片开始，三星还需要大约 3 个月完成工艺优化。按照这一节奏，具备商业供货条件的量产产品或将在 5 月中旬形成规模，并在随后逐步扩大出货。业内人士指出，先前部分报道称三星电子可能在 2 月就开始向英伟达供应 HBM4，更可能指的是去年 12 月产出的少量样品，并不代表全面量产已经启动。IT之家从报道中获悉，三星电子还希望借助 12 层堆叠 HBM4 进展稳定的契机，加快推进 16 层堆叠 HBM4 等更高规格产品，但具体时间仍需等待客户验证以及市场需求进一步明朗。《IT之家》原文链接：https://news.qq.com/rain/a/20260126A01LMO00","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; 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