ASMPT宣布计划剥离SMT业务聚焦半导体业务

证券日报01-26

本报讯全球半导体封装设备龙头ASMPT于近日发布公告宣布，公司正评估旗下表面贴装技术业务（SMT）选项，有可能涉及出售、合营、分拆或上市。　　ASMPT相关人士表示，ASMPT计划通过剥离旗下海外非半导体业务，全面聚焦于半导体核心领域，不断优化资产结构。　　公开资料显示，2011年，ASMPT以一笔巨额收购将西门子的SMT业务收入囊中，这不仅让其一举成为全球SMT设备的头部企业，更开辟了庞大的...

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ASMPT宣布计划剥离SMT业务 聚焦半导体业务

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ASMPT宣布计划剥离SMT业务聚焦半导体业务