凌玮科技：球形硅微粉可应用于HBM封装

证券之星01-22

证券之星消息，凌玮科技(301373)01月21日在投资者关系平台上答复投资者关心的问题。

投资者提问：公司的球形硅微粉可否用于HBM封装材料填充？

凌玮科技回复：您好！公司产品球形硅微粉，可广泛应用于电子电路基板、电子封装、HBM封装、电子胶粘结剂塑料粒子、薄膜纤维、抛光、特种陶瓷和油墨涂料等领域。感谢您的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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