史无前例！两大芯片巨头联手

半导体封测01-24

转自：芯片大师1月23日消息，据《经济日报》报道，英特尔和联电将进行世纪大合作，联手抢占AI市场。报道称，英特尔计划将其原本独家用于下一代埃米级制程及先进封装的关键技术—Super MIM 电容，授权给联电使用。英特尔正规划优先将Super MIM电容技术向下导入与联电既有合作的12nm／14nm制程平台，并延伸至先进封装相关应用。知情人士透露，联电内部已成立专门团队推进该合作项目，而英特尔方面则...

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