【海翔科技】泛林半导体 Lam Research Vector 系列二手薄膜沉积CVD设备拆机/整

与非网01-22

一、引言在半导体晶圆制造的薄膜沉积环节，化学气相沉积（CVD）设备是保障器件绝缘性能与结构完整性的核心装备，尤其在逻辑芯片介质层、存储芯片钝化层制造中发挥关键作用。泛林半导体（Lam Research）作为全球半导体设备寡头企业之一，其Vector系列CVD设备凭借高精度介质层沉积、宽工艺窗口适配等核心优势，已成为全球主流晶圆厂的标杆级装备，广泛应用于28nm及以上成熟制程的介质层沉积、钝化层制备...

网页链接

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

精彩评论

我们需要你的真知灼见来填补这片空白

发表看法

{"i18n":{"language":"zh_CN"},"isChannel":false,"data":{"share":"https://www.laohu8.com/m/news/2605658410?lang=zh_CN&edition=full","thumbnail":"","is_english":false,"pubTime":"2026-01-22 16:04","share_image_url":"https://static.laohu8.com/9a95c1376e76363c1401fee7d3717173","id":"2605658410","market":"us","top_or_hot":-1,"title":"【海翔科技】泛林半导体 Lam Research Vector 系列 二手薄膜沉积CVD设备拆机/整","media":"与非网","content":"<div>\n<p>一、引言在半导体晶圆制造的薄膜沉积环节，化学气相沉积（CVD）设备是保障器件绝缘性能与结构完整性的核心装备，尤其在逻辑芯片介质层、存储芯片钝化层制造中发挥关键作用。泛林半导体（Lam Research）作为全球半导体设备寡头企业之一，其Vector系列CVD设备凭借高精度介质层沉积、宽工艺窗口适配等核心优势，已成为全球主流晶圆厂的标杆级装备，广泛应用于28nm及以上成熟制程的介质层沉积、钝化层制备...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260122160952a69fa703&s=b\">网页链接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>【海翔科技】泛林半导体 Lam Research Vector 系列 二手薄膜沉积CVD设备拆机/整</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n【海翔科技】泛林半导体 Lam Research Vector 系列 二手薄膜沉积CVD设备拆机/整\n</h2>\n\n<h4 class=\"meta\">\n\n\n2026-01-22 16:04 北京时间&nbsp;&nbsp;&nbsp;<a href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260122160952a69fa703&s=b><strong>与非网</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>一、引言在半导体晶圆制造的薄膜沉积环节，化学气相沉积（CVD）设备是保障器件绝缘性能与结构完整性的核心装备，尤其在逻辑芯片介质层、存储芯片钝化层制造中发挥关键作用。泛林半导体（Lam Research）作为全球半导体设备寡头企业之一，其Vector系列CVD设备凭借高精度介质层沉积、宽工艺窗口适配等核心优势，已成为全球主流晶圆厂的标杆级装备，广泛应用于28nm及以上成熟制程的介质层沉积、钝化层制备...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260122160952a69fa703&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0274383776.USD","symbol_name":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260122160952a69fa703&s=b","article_id":"2605658410","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260122160952a69fa703&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"url":"https://stock-news.laohu8.com/highlight/detail?id=2605658410","pubTimestamp":1769069098,"columns":[],"sourceInfo":{"source_id":"tencent","name":"腾讯"},"weMediaInfo":null,"summary":"泛林半导体作为全球半导体设备寡头企业之一，其Vector系列CVD设备凭借高精度介质层沉积、宽工艺窗口适配等核心优势，已成为全球主流晶圆厂的标杆级装备，广泛应用于28nm及以上成熟制程的介质层沉积、钝化层制备等场景。海翔科技，以多元产品矩阵与专业服务，为半导体产业发展注入强劲动力。","collect":0,"end_time":0,"defaultTopTitle":"qq.com","property":[],"viewcount":null,"language":"zh","relate_stocks":{"LU0274383776.USD":"MANULIFE GF US SMALL CAP EQUITY \"AA\" (USD) INC","LU0082616367.USD":"摩根大通美国科技A（dist）","LU0187121727.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) INC","LU0823434740.USD":"BNP PARIBAS US GROWTH \"C\" (USD) INC","IE00B775H168.HKD":"JANUS HENDERSON BALANCED \"A5M\" (HKD) INC","IE0004445015.USD":"JANUS HENDERSON BALANCED \"A2\" (USD) ACC","BK4567":"ESG概念","LU0957791311.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"ZU\" (USD) ACC","IE00B5949003.HKD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A\" (HKD) ACC","LU0444973449.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"DU\" (USD) ACC","BK4585":"ETF&股票定投概念","IE0005OL40V9.USD":"JANUS HENDERSON BALANCED \"A6M\" (USD) INC","LU2089985449.USD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (USD) ACC","LU1046421795.USD":"富达环球科技A-ACC","LU1852331112.SGD":"Blackrock World Technology Fund A2 SGD-H","LU1642822529.SGD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"A\" (SGD) ACC","BK4533":"AQR资本管理(全球第二大对冲基金)","LU0942090050.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD)  INC","LU0823434583.USD":"BNP PARIBAS US GROWTH \"C\" (USD) ACC","LU0476273544.USD":"CT (LUX) I GLOBAL TECHNOLOGY \"BU\" (USD) ACC","LU2931357623.SGD":"MANULIFE GF GLOBAL SEMICONDUCTOR OPPORTUNITIES \"AA\" (SGDHDG) ACC","IE00BQXX3F31.USD":"GUINNESS GLOBAL INNOVATORS \"C\" (USD) ACC","LU0061474960.USD":"天利环球焦点基金AU Acc","IE00BFSS8Q28.SGD":"Janus Henderson Balanced A Inc SGD-H","LU0348723411.USD":"ALLIANZ GLOBAL HI-TECH GROWTH \"A\" (USD) INC","IE00BJJMRY28.SGD":"Janus Henderson Balanced A Inc SGD","LU2023250843.SGD":"Allianz Thematica Cl AT Acc H2-SGD","LU2023250504.SGD":"Allianz Thematica Cl AMg DIS H2-SGD","LU1815336760.USD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"AUP\" (USD) INC","LU1720051108.HKD":"ALLIANZ GLOBAL ARTIFICIAL INTELLIGENCE \"AT\" (HKD) ACC","LU2360106780.USD":"BGF WORLD TECHNOLOGY \"A4\" (USD) INC","LU0157215616.USD":"FIDELITY GLOBAL FOCUS \"A\" INC","BK4535":"淡马锡持仓","LU1917777945.USD":"安联专题基金Cl AT Acc","LU1720051017.SGD":"Allianz Global Artificial Intelligence AT Acc H2-SGD","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","LU0081259029.USD":"UBS (LUX) EQUITY FUND - TECH OPPORTUNITY \"P\" (USD) ACC","LU0056508442.USD":"贝莱德世界科技基金A2","LU1548497426.USD":"安联环球人工智能AT Acc","LU2244417387.USD":"FIDELITY SUSTAINABLE US EQUITY \"A\" (USD) ACC","LU2250418816.HKD":"BGF WORLD TECHNOLOGY \"A\" (HKD) ACC","LU1235294995.USD":"FIDELITY GLOBAL TECHNOLOGY \"A\" (USDHDG) ACC","IE00BJJMRX11.SGD":"Janus Henderson Balanced A Acc SGD","LU0061475181.USD":"THREADNEEDLE (LUX) AMERICAN \"AU\" (USD) ACC","LU0096362180.USD":"CT (LUX) I GLOBAL FOCUS \"DU\" (USD)","BK4588":"碎股","LU1670627923.USD":"M&G (LUX) NORTH AMERICAN DIVIDEND \"A\" (USD) ACC","LU1670628061.USD":"M&G (LUX) NORTH AMERICAN DIVIDEND \"A\" (USD) INC","LU0868494708.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) INC","LU2357305700.SGD":"Allianz Global Artificial Intelligence ET H2-SGD","BK4147":"半导体设备","LU1823568750.SGD":"Fidelity Global Technology A-ACC SGD","LU1815333072.USD":"THREADNEEDLE (LUX) GLOBAL FOCUS \"AUP\" (USD) INC","LU0444971666.USD":"天利全球科技基金","LU1069347547.HKD":"AB SICAV I - GLOBAL VALUE PORTFOLIO \"AD\" (HKD) INC","IE00B7KXQ091.USD":"Janus Henderson Balanced A Inc USD","BK4551":"寇图资本持仓","IE00BQXX3D17.EUR":"GUINNESS GLOBAL INNOVATORS \"C\" (EUR) ACC","LU1366333091.USD":"FIDELITY GLOBAL FOCUS \"A\" (USD) ACC","LRCX":"拉姆研究","LU0719512351.SGD":"JPMorgan Funds - US Technology A (acc) SGD","LU1035773651.USD":"AB SICAV I - GLOBAL VALUE PORTFOLIO \"AD\" (USD) INC","BK4561":"索罗斯持仓","IE00BQXX3C00.GBP":"GUINNESS GLOBAL INNOVATORS \"C\" (GBP) ACC","IE00BFSS7M15.SGD":"Janus Henderson Balanced A Acc SGD-H","IE0009356076.USD":"JANUS HENDERSON GLOBAL TECHNOLOGY AND INNOVATION \"A2\" (USD) ACC","IE00BSNM7G36.USD":"NEUBERGER BERMAN SYSTEMATIC GLOBAL SUSTAINABLE VALUE \"A\" (USD) ACC","LU1974910355.USD":"Allianz Thematica Cl AMg DIS USD","IE00B4JS1V06.HKD":"JANUS HENDERSON BALANCED \"A2\" (HKD) ACC","LU0868494617.USD":"UBS (LUX) EQUITY SICAV - US TOTAL YIELD SUSTAINABLE \"P\" (USD) ACC","BK4581":"高盛持仓","LU0957808578.USD":"THREADNEEDLE (LUX) GLOBAL TECHNOLOGY \"ZU\" (USD) ACC","BK4543":"AI","IE00BN29S564.USD":"JANUS HENDERSON BALANCED \"A3\" (USD) INC"},"translate_title":"[Haixiang Technology] Fanlin Semiconductor Lam Research Vector series second-hand thin film deposition CVD equipment disassembly/completion","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"LRCX":1.91},"content_text":"一、引言在半导体晶圆制造的薄膜沉积环节，化学气相沉积（CVD）设备是保障器件绝缘性能与结构完整性的核心装备，尤其在逻辑芯片介质层、存储芯片钝化层制造中发挥关键作用。泛林半导体（Lam Research）作为全球半导体设备寡头企业之一，其Vector系列CVD设备凭借高精度介质层沉积、宽工艺窗口适配等核心优势，已成为全球主流晶圆厂的标杆级装备，广泛应用于28nm及以上成熟制程的介质层沉积、钝化层制备等场景。海翔科技推出该系列二手设备拆机/整机供应方案，并配套标准化现场验机评测服务，既精准匹配中小半导体企业降本增效的核心诉求，又通过专业性能核验规避二手设备交易风险，为产业高质量发展提供高性价比装备支撑。二、Vector系列设备核心技术特性Vector系列设备以稳定的介质层沉积性能和广泛的工艺适配性为核心竞争力，技术特性深度契合成熟制程制造需求。在薄膜质量控制方面，该系列设备采用先进的等离子体增强化学气相沉积（PECVD）技术，搭配精准的气体配比与等离子体密度调控系统，可实现SiO₂、SiNₓ等介质薄膜的高精度沉积，薄膜折射率偏差≤±0.01，台阶覆盖率≥95%，有效保障器件绝缘性能与结构稳定性。同时，设备搭载自适应腔室清洁系统，可实时清除腔室残留沉积物，降低颗粒污染风险，提升长期运行可靠性。在工艺适配与量产效率上，设备采用多腔室并行架构，支持不同介质层沉积工艺快速切换，可适配6英寸、8英寸晶圆制造需求，兼容逻辑芯片、功率器件、传感器等多种产品类型的生产。单台设备每小时晶圆处理量可达25片以上，搭配自动化晶圆传输与定位系统，定位偏差≤0.1mm，显著提升规模化生产效率。此外，设备内置智能化工艺监控模块，可实时采集沉积温度、压力等关键参数，实现工艺异常预警，保障产品良率稳定性。三、海翔科技拆机/整机供应方案针对半导体企业差异化采购需求，海翔科技构建多元化供应体系：其一，整机供应方案。所供二手Vector系列设备均经过全流程翻新与性能校准，核心工艺指标达标率≥95%，配套原厂级技术文档与安装调试服务，确保设备快速适配现有产线，缩短投产周期。其二，拆机供应方案。聚焦设备核心功能组件，涵盖等离子体反应腔、高精度气体配送单元、多腔室控制模块及自动化传输系统等，企业可按需替换老化部件，在控制维护成本的同时，保障整机运行稳定性。所有设备均符合《二手设备流通技术规范》要求，具备完整的维护维修记录与品质鉴定基础。四、现场验机评测体系海翔科技建立符合半导体设备行业标准的现场验机评测体系，全面覆盖设备基础性能与工艺核心指标。基础性能评测方面，重点核查真空系统（基压＜5 mtorr，压力控制精度±0.1 torr）、温控系统（腔室温度均匀性＜±5℃）及传输系统稳定性（晶圆定位偏差≤0.1mm），同时依据GB5226.1等环保安全标准，检测设备噪音、污染物排放及电气安全性能。工艺性能评测采用试沉积验证模式：通过X射线光电子能谱（XPS）分析薄膜成分纯度（杂质含量＜1ppm），利用椭圆偏振仪检测薄膜折射率与厚度均匀性（厚度偏差≤0.3nm），借助原子力显微镜（AFM）评估薄膜表面粗糙度（Ra≤0.6nm）。全程由资深半导体设备工程师操作，出具包含详细测试数据的评测报告，实现设备性能可视化核验，保障交易透明性与可靠性。五、设备应用价值与市场意义Vector系列二手设备的市场化供应，对推动半导体成熟制程降本增效具有重要意义。在逻辑芯片领域，可适配28nm-90nm制程的介质绝缘层沉积，保障器件电学性能稳定性；在功率半导体领域，支持SiC、GaN器件的钝化层制备，提升器件耐高压、耐高温性能；在传感器制造领域，可实现高精度介质薄膜沉积，优化传感灵敏度。海翔科技的供应方案与验机服务，不仅降低了中小半导体企业进入成熟制程领域的设备投入门槛，更通过标准化评测保障设备性能，助力企业实现技术升级与成本控制的平衡，对完善半导体设备供应链、推动产业高质量发展具有积极作用。海翔科技 —— 深耕二手半导体设备领域的专业领航者，凭借深厚行业积累，为客户打造一站式设备及配件供应解决方案。在半导体前段制程领域，我们拥有海量优质二手设备资源，精准匹配芯片制造的关键环节需求；后道封装设备板块，丰富的设备品类覆盖封装全流程，助力客户降本增效。我们还提供齐全的二手半导体专用配件，从核心部件到精密耗材，为设备稳定运行保驾护航。海翔科技，以多元产品矩阵与专业服务，为半导体产业发展注入强劲动力。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2605658410","isCrawlerRequest":true}

【海翔科技】泛林半导体 Lam Research Vector 系列 二手薄膜沉积CVD设备拆机/整

精彩评论

【海翔科技】泛林半导体 Lam Research Vector 系列二手薄膜沉积CVD设备拆机/整