深科技：作为国内高端存储芯片封测的龙头企业

证券之星01-23

证券之星消息，深科技(000021)01月23日在投资者关系平台上答复投资者关心的问题。

投资者提问：请问深科技是否有高带宽内存(HBM)和高带宽闪存(HBF)的技术能力？

深科技回复：尊敬的投资者，您好！作为国内高端存储芯片封测的龙头企业，公司拥有行业经验丰富的研发和工程团队，具备精湛的多层堆叠封装工艺能力和测试软件开发能力。公司会密切关注行业发展动态和前沿技术的发展趋势。感谢您的关注！

以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。

免责声明：本文观点仅代表作者个人观点，不构成本平台的投资建议，本平台不对文章信息准确性、完整性和及时性做出任何保证，亦不对因使用或信赖文章信息引发的任何损失承担责任。

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