PCB关键材料涨价超30%，AI需求与技术变革成关键推手

电路板智造01-21

△广告与正文无关近日，全球半导体与电子材料领域再现价格波动。据MoneyDJ报道，由于玻纤布等原材料供应紧张、价格大幅上涨，日本知名材料厂商Resonac（原昭和电工）宣布，自3月1日起上调铜箔基板（CCL）、黏合胶片等PCB材料售价，涨幅高达30%以上。公司表示，此举是为应对成本压力、稳定产品供应及持续技术投入所采取的不得已措施。Resonac并非近期首家调价的厂商。早在去年底，行业另一重要...

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drivers","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AMD":0.9,"NVDS":0.6,"NVDW":0.6,"NVDS.UK":0.6,"NVDG":0.6,"NVD":0.6,"DIPS":0.6,"NVDA":1.88,"3NVD.UK":0.6,"NVDY":0.6,"NVIW.SI":0.6,"NVDQ":0.6,"NVDD":0.6,"2NVD.UK":0.6,"NVD2.UK":0.6,"NVDU":0.6,"NVDX":0.6,"NVD3.UK":0.6,"NVII":0.6,"SNVD.UK":0.6},"content_text":"△广告与正文无关近日，全球半导体与电子材料领域再现价格波动。据MoneyDJ报道，由于玻纤布等原材料供应紧张、价格大幅上涨，日本知名材料厂商Resonac（原昭和电工）宣布，自3月1日起上调铜箔基板（CCL）、黏合胶片等PCB材料售价，涨幅高达30%以上。公司表示，此举是为应对成本压力、稳定产品供应及持续技术投入所采取的不得已措施。Resonac并非近期首家调价的厂商。早在去年底，行业另一重要供应商建滔集团已向客户发出涨价函，宣布因难以消化原材料成本，对新接订单的CCL价格全面上调10%。这预示着CCL行业正面临普遍的成本传导压力。本次涨价潮背后，是来自下游AI算力需求的强势拉动与PCB技术升级的双重驱动。一方面，AI服务器需求的爆发式增长正在争夺高端材料产能。有消息指出，苹果、高通等消费电子巨头因英伟达、AMD等AI服务器供应商争抢有限货源，被迫寻求新的高端玻纤布供应源。另一方面，技术变革也在扩大对高端材料的需求。例如，CoWoS方案的积极打样推动了芯片直连PCB的演进，若该方案大面积推行，将显著拉动类载板级别的材料需求。更为市场关注的是，英伟达计划于2026年下半年发布的Rubin架构，其内部PCB预计采用M9级CCL。国盛证券分析指出，AI服务器设计正经历结构性转变，PCB角色从单纯的电路载体升级为“算力释放的核心层”，行业正式进入高频、高功耗、高密度的“三高时代”。在此背景下，招商电子研判认为，“涨价”将成为CCL行业2026年的主旋律。上游原材料价格持续上涨、下游AI需求挤占产能以及PCB环节库存低位，这三重因素有望驱动CCL价格中长期处于上升通道。从投资角度看，CCL的成本结构主要由铜箔（约42%）、树脂（约26%）和玻纤布（约20%）构成。随着CCL向M8、M9等高等级升级，三大主材均面临性能提升与需求放量：玻纤布：一代、二代布为当前主流高端材料，Q布放量在即，市场缺口严重。电子铜箔：AI需求正推动HVLP铜箔加速升级，需求快速增长。树脂：M8+、M9等级CCL的升级，有望推动碳氢树脂需求放量。综合来看，源自原材料端的成本压力与AI服务器引领的技术需求，正共同重塑PCB材料市场格局，一场由高端应用驱动全产业链升级与价格重估的变革已然展开。来源：综合整理","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":2,"commentSize":0,"repostSize":0,"favoriteSize":1,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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