消息称台积电今年再在岛内投资建设 4 座先进封装设施

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台媒本月 17 日报道称，台积电今年将再在岛内投资建设 4 座先进封装设施以回应 AI 芯片客户的需求。这 4 座新厂将是嘉义科学园区先进封装二期的两座和南部科学园区三期的两座，相关决定有望在本周官宣。台积电在上周的季度法人说明会上曾表示，先进封装在 2025 年已为企业贡献一成营收，同时未来增速将超过企业平均水平。在支出端，先进封装与掩膜制造和其它将占到台积电今年整体资本开销的 10~20%。...

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