今年再盖4座先进封装厂？台积电称“以公开资讯为主”

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媒体17日报道，供应链传出，台积电今年或计划再投资建4座先进封装厂。据称，晶圆代工龙头厂台积电持续投资中国台湾，除先进制程的晶圆厂之外，也大手笔投资先进封装（AP），供应链传出，台积电今年将再建4座先进封装厂。预计下周由资深副总经理暨副共同营运长侯永清对外宣布。台积电15日召开法说会，台积电董事长魏哲家表示，台积电正在新竹和高雄科学园区筹备数期2nm晶圆厂，未来数年将持续在中国台湾投资先进制程及...

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