以硅桥取代中介层：英特尔EMIB封装强调成本与设计自由度优势

爱集微01-18

英特尔本周四发表的文章详细介绍了其EMIB（嵌入式多芯片互连桥）封装技术的优势，并将其与业界普遍采用的2.5D封装方案进行对比。公司强调，EMIB在成本、设计复杂度和系统灵活性方面表现更优，更适合支撑下一代高性能芯片的扩展。目前行业主流的2.5D封装方案依赖一整块硅中介层和硅通孔（TSV）来实现芯粒间的互连。英特尔指出，这种方案不仅因为使用大面积的硅中介层而推高成本，TSV工艺还可能影响整体良率，...

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