SK海力士与三星加速HBF技术商业化进程预计最快明年应用于英伟达产品

太平洋科技01-18

SK海力士正与闪迪合作制定HBF标准，计划最早于今年推出采用16层NAND闪存堆叠的HBF1样品。据悉，三星电子和闪迪计划最快在2027年底或2028年初将HBF技术应用于英伟达、AMD和谷歌的实际产品中。HBM之父金正浩教授表示，HBF研发速度将比HBM更快。HBF即高带宽闪存，通过堆叠NAND闪存制成。金正浩预测，2至3年内HBF方案将频繁涌现，到2038年左右HBF市场将超过HBM市场。随着...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260118121214a72790e4&s=b><strong>太平洋科技</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>SK海力士正与闪迪合作制定HBF标准，计划最早于今年推出采用16层NAND闪存堆叠的HBF1样品。据悉，三星电子和闪迪计划最快在2027年底或2028年初将HBF技术应用于英伟达、AMD和谷歌的实际产品中。HBM之父金正浩教授表示，HBF研发速度将比HBM更快。HBF即高带宽闪存，通过堆叠NAND闪存制成。金正浩预测，2至3年内HBF方案将频繁涌现，到2038年左右HBF市场将超过HBM市场。随着...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260118121214a72790e4&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0354030511.USD","symbol_name":"ALLSPRING  U.S. LARGE CAP GROWTH \"I\" (USD) 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SK海力士与三星加速HBF技术商业化进程 预计最快明年应用于英伟达产品

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SK海力士与三星加速HBF技术商业化进程预计最快明年应用于英伟达产品