百度智能云全球物联网芯片领导者乐鑫科技，为AI硬件开基筑底

百度智能云01-20

在AI与物联网深度融合的今天，一场围绕AI硬件底层基础设施的共建正在悄然展开。百度智能云与全球物联网芯片领导者乐鑫科技（688018.SH）携手，不止于产品适配与技术整合，更致力于为AI硬件产业打造坚实基座——双方以“筑基者”的姿态，通过芯片、云端与生态的深度协同，共同推动行业向标准化、规模化与可持续化方向演进。强强联合：从技术适配到生态共建作为中国科创板首批上市企业，乐鑫科技连续8年保持全球Wi...

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SoC研发，并以开源技术为核心构建了全球化的全栈AIoT平台。百度智能云则凭借百度强大AI大模型技术及平台，为AI硬件提供从模型、到平台、到应用的全栈能力。目前，百度智能云已完成对乐鑫ESP32-C3、ESP32-S3及ESP32-P4系列芯片的底层驱动与协议栈深度适配。双方通过与乐鑫ODM生态伙伴的协同，打通了从芯片选型、模组烧录到实时音视频（RTC）能力云端接入的标准化交付链路，显著降低了AI硬件的开发门槛与量产周期。乐鑫科技合作芯片赋能场景：让AI落地千行百业基于双方整合的一站式多模态实时互动服务，AI硬件企业可快速构建具备实时音视频对话能力的智能产品。目前，该合作已赋能AI玩具、智能家居等多个细分领域，支持语音交互、多模态识别等核心场景，为企业智能化升级与用户体验提升注入加速度。已携手拓展的行业伙伴如实丰文化、灵优智学等，正是这一合作价值的早期见证者与受益者。通过低功耗芯片与云端智能的结合，智能设备得以更自然、更实时地与人交互，让技术真正融入生活细节。生态价值：不止于产品，更在于沃土乐鑫科技的企业精神中贯穿着“以艺术家的视角看待技术开发”的理念——强调创新、勇敢、原创，并致力于通过技术解决社会关键挑战、赋能多元创新社区。这种精神与百度智能云推动产业智能化的使命高度契合。双方的合作，本质上是在共同培育一片开放的AI硬件生态沃土：技术层：通过芯片与云能力的深度融合，构建稳定、可扩展的底层技术体系；工具层：提供开箱即用的开发工具与服务，降低创新门槛；生态层：联合开发者社区、ODM伙伴与行业客户，形成共创共赢的良性循环；人才层：通过赛事、高校合作与创新挑战，激发持续创新的源头活水。未来之路：共筑AI硬件可持续生态面向未来，百度智能云与乐鑫科技将以AI硬件产业发展为核心，构建覆盖技术、生态与人才培育的长期合作模式。双方将持续推进芯片、模组与云端AI能力的协同优化，完善面向AI硬件的标准化技术栈；并通过开放社区、产业联动与示范项目，加速创新应用孵化，推动整个行业向更智能、更互联、更普惠的方向可持续发展。在这场智能变革中，百度智能云与乐鑫科技不仅是技术的提供方，更是生态的共建者与产业的筑基人。通过芯片与云的深度握手，双方正携手描绘一个更连接、更智能、更具创新活力的硬件未来。混合云AI智算平台“领导者”！点击“阅读原文”，立即合作咨询！","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"isVideo":false,"video":null,"symbols":[],"gpt_button":0,"need_auth":false,"need_login_tip":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 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百度智能云 全球物联网芯片领导者乐鑫科技，为AI硬件开基筑底

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百度智能云全球物联网芯片领导者乐鑫科技，为AI硬件开基筑底