甬硅电子(688362.SH)拟不超21亿元投建马来西亚集成电路封装和测试生产基地

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智通财经APP讯，甬硅电子(688362.SH)发布公告，根据公司战略规划，为进一步完善公司海外战略布局，推动海外业务发展进程，公司拟投资新建马来西亚集成电路封装和测试生产基地项目，投资总额不超过人民币21亿元(实际投资金额以中国及当地主管部门批准金额为准)，约占公司总资产的13.68%(截至2025年9月30日)。该项目建设内容主要为系统级封装产品等封装产品，下游应用领域包括AIoT、电源模组等...

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